EUV Chamber Heat Shield with Stress-Absorbing Support
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Solution Overview
Problem
In extreme ultraviolet (EUV) light generation apparatuses, thermal deformation of the chamber receptacle due to radiant light from plasma and scattered laser light leads to instability and precision issues in positioning and orientation of devices, affecting the output of EUV light for semiconductor production.
Innovation Solution
A heat shield is disposed within the chamber receptacle to absorb radiant light and scattered laser light, supported by a support portion that absorbs stress caused by thermal deformation, thereby reducing thermal deformation of the chamber receptacle and stabilizing the positions and orientations of attached devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heat shield is added to absorb radiant light and scattered laser light, then thermal deformation of the chamber receptacle is suppressed, but device complexity increases
Solution Approach 1:
A heat shield is introduced as an intermediary component between the plasma generation region and the chamber receptacle. This heat shield absorbs radiant light and scattered laser light, preventing direct thermal exposure of the chamber receptacle and thereby suppressing thermal deformation while maintaining device stability.
Solution Approach 2:
The support portion is designed with a flexible structure that can elastically deform to accommodate thermal expansion and contraction of the heat shield. This flexible design allows the support portion to absorb stress produced by thermal deformation without transmitting it to the chamber receptacle, thus maintaining structural integrity while reducing overall system complexity.
2Reliability
If the support portion is designed to be flexible to absorb stress from thermal deformation, then thermal deformation is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The support portion is designed with specific elastic properties and geometric parameters that enable it to absorb stress from thermal deformation. By carefully selecting material properties and dimensional parameters, the support portion can effectively accommodate thermal expansion while maintaining stable attachment to both the heat shield and chamber receptacle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses thermal deformation of the chamber receptacle, maintaining the precision and stability of device positions and orientations, ensuring consistent EUV light output for semiconductor microfabrication.
Implementation Method 1
The heat shield may be disposed within the chamber receptacle between a predetermined region where the target material turns into plasma and the chamber receptacle and may be configured to absorb heat produced at the predetermined region when the target material turns into plasma
Implementation Method 2
At least one of the heat shield and the support portion may include an absorbing portion configured to absorb stress produced in the heat shield deforming due to the heat, by expanding/contracting in response to the thermal deformation of the heat shield
Data Source
AI summary
A chamber used in an extreme ultraviolet light generation apparatus that generates extreme ultraviolet light by irradiating a target material with a laser beam may include a chamber receptacle, a heat shield that is disposed within the chamber receptacle between a predetermined region where the target material turns into plasma and the chamber receptacle and that is configured to absorb heat produced at the predetermined region when the target material turns into plasma, and a support portion configured to attach the heat shield to the chamber receptacle, and further, the support portion may include an absorbing portion configured to absorb stress produced in the heat shield deforming due to the heat, by expanding/contracting in response to the thermal deformation of the heat shield.