EUV Collector Inline Cleaning for Debris Removal and Throughput

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Solution Overview

Problem

The accumulation of debris, such as tin droplets and pests, on the collector mirror surface in EUV lithography systems reduces EUV conversion efficiency, leading to downtime and decreased throughput in wafer production.

Innovation Solution

An inline cleaning method using low-temperature cleaners to transition large debris to small debris, combined with piezo vibrators to break up debris and exhaust air flow to remove small debris, minimizing downtime and improving throughput.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the collector is cleaned by removing it from the tool, then cleaning effectiveness is improved, but downtime increases and productivity decreases

Engineering Contradiction:

Improvecleaning effectivenessVSAvoidwafer production throughput

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The cleaning system enables the collector to be cleaned in situ within the lithography tool without removal. The nozzle delivers cleaning solution directly to the collector surface, and the shaking mechanism agitates the collector to dislodge debris, allowing the system to service itself during operation pauses without requiring external handling or removal procedures

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The cleaning process is integrated into the tool's operational cycle, allowing cleaning to occur during scheduled maintenance intervals without requiring complete system shutdown or collector removal. The inline cleaning maintains continuous operational readiness by eliminating the time loss associated with collector removal and reinstallation

Inventive Principle:

Principle #20Continuity of useful action

2Manufacturing precision

If low-temperature cleaners are used to transition large debris to small debris, then cleaning precision is improved, but processing time increases

Engineering Contradiction:

Improvedebris size controlVSAvoidcleaning duration

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The shaking mechanism applies mechanical vibration to the collector during the cleaning process. This vibration agitates the collector surface, accelerating the transition of large debris to smaller debris and facilitating faster removal of cleaning solution and debris particles, thereby reducing the overall cleaning time while maintaining precision

Inventive Principle:

Principle #18Mechanical vibration

Solution Approach 2:

The system uses low-temperature cleaners to induce phase transition in debris (from large to small), and combines this with controlled temperature and flow rate parameters of the cleaning solution to optimize the cleaning process speed and effectiveness without excessive processing time

Inventive Principle:

Principle #35Parameter changes

3Reliability

If piezo vibrators are used to break up debris, then debris removal effectiveness is improved, but device complexity increases

Engineering Contradiction:

Improvedebris removal effectivenessVSAvoidcleaning system structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Piezoelectric vibrators are integrated into the cleaning system to generate high-frequency mechanical vibrations that directly contact the collector surface. These vibrations mechanically break up adhered debris and facilitate its removal, providing effective cleaning through a relatively simple actuator mechanism

Inventive Principle:

Principle #18Mechanical vibration

Solution Approach 2:

The cleaning system combines piezoelectric vibration with pneumatic or hydraulic delivery of cleaning solution through a nozzle. This combination uses fluid dynamics to enhance the mechanical vibration effect, flushing away broken debris while maintaining a relatively simple overall system architecture

Inventive Principle:

Principle #29Pneumatics and hydraulics

4Productivity

If inline cleaning is performed, then downtime is reduced, but cleaning thoroughness may be compromised

Engineering Contradiction:

Improvewafer production throughputVSAvoidcleaning thoroughness

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The shaking mechanism provides mechanical agitation to the collector during inline cleaning, ensuring thorough debris removal despite the constrained time and space conditions of in-situ cleaning. The vibration prevents debris from re-adhering and facilitates complete removal of cleaning solution

Inventive Principle:

Principle #18Mechanical vibration

Solution Approach 2:

The inline cleaning system maintains continuous operational capability by integrating cleaning into the tool's normal operational cycle. The process is designed to achieve sufficient cleaning thoroughness within the available time window, allowing the system to return to productive operation quickly while maintaining acceptable cleaning standards

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively reduces downtime by cleaning the collector inline, enhancing EUV conversion efficiency and increasing wafer production throughput without removing the collector from the tool.

Implementation Method 1

transition large debris to small debris

Methodology Applied

Scientific EffectPhase transition: Phase Change

Implementation Method 2

piezo vibrators to break up debris

Methodology Applied

Scientific EffectMechanical vibration: Vibration

Implementation Method 3

exhaust air flow to remove small debris

Methodology Applied

Scientific EffectAir flow: Convection

Data Source

PatentUS20260072363A1Methods of cleaning a lithography system

Publication Date: 2026.03.12 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method includes: removing debris on a collector of a lithography equipment by changing physical structure of the debris with a cleaner; forming a cleaned collector by exhausting the removable debris from the collector, and forming openings in a mask layer on a substrate by removing regions of the mask layer exposed to radiation from the cleaned collector.