EUV Light Source Flow Guide Layout for Debris Control
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Solution Overview
Problem
Contaminants such as debris from metal droplets generated during EUV light production adhere to the EUV light source and components within a lithography apparatus, causing defects in equipment and reducing the reliability of the lithography process.
Innovation Solution
A light generation device with a vessel, collector, droplet generator, and flow guide that controls the flow path of gases to prevent debris from depositing on internal surfaces, using a multi-layer mirror and gas flow guides to manage debris movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a laser beam is used to irradiate metal droplets to generate EUV light, then EUV light can be produced for lithography processes, but debris from the metal droplets adheres to the EUV light source and components, causing defects
Solution Approach 1:
A gas flow is introduced as an intermediary substance between the laser beam and metal droplets. The gas flows through nozzles positioned at specific locations to carry debris away from the EUV light source and components, preventing contamination while allowing the laser to continue generating EUV light from the metal droplets
Solution Approach 2:
The patent employs a pneumatic system using gas flow to control debris removal. Gas is supplied through multiple nozzles positioned at different locations within the vessel to create controlled airflow patterns that prevent debris accumulation on the EUV light source and internal components, enabling continuous operation without contamination
2Object-affected harmful factors
If gas flow is used to remove debris, then contamination can be reduced, but the device complexity increases with additional flow guides and nozzles
Solution Approach 1:
The gas flow system is segmented into multiple independent nozzles positioned at different locations within the vessel. Each nozzle can be independently controlled to target specific debris generation zones, allowing the complex debris removal function to be divided into simpler, manageable units that reduce overall system complexity
Solution Approach 2:
The gas flow system serves multiple functions simultaneously: it cools the metal droplets during laser irradiation, carries debris away from the EUV light source, and maintains stable plasma conditions. This multi-functionality reduces the need for separate systems, thereby reducing overall device complexity while effectively addressing contamination
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces debris contamination on internal components, enhancing the reliability and efficiency of EUV light generation and lithography processes by minimizing debris deposition and foreign object discharge.
Implementation Method 1
a common method of generating EUV light is a laser-produced plasma (LPP) technique, which involves irradiating a metal droplet, such as tin, with a laser beam
Implementation Method 2
a flow guide configured to control a flow path of gas supplied to the internal space of the vessel
Data Source
AI summary
A light generation device includes a vessel configured to define an internal space extending in a first direction, a collector disposed adjacent to one end portion of the vessel and having an aperture at a central portion of the collector, a droplet generator configured to provide a droplet to the internal space of the vessel, a light source configured to provide a laser beam to the droplet in the vessel, and a flow guide configured to control a flow path of gas supplied to the internal space of the vessel, wherein the flow guide may include a first flow guide connected to the collector, a second flow guide provided within the aperture and spaced apart from the first flow guide, and a third flow guide provided between the first and second flow guides.