Interface Signal Testing for EUV Lithography Vacuum Electronics
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Solution Overview
Problem
EUV lithography apparatuses face complex structure and burdensome troubleshooting due to vacuum requirements and complex cabling, making it difficult to check the interface for electrical signal transmission to electronics units without operational cooling systems.
Innovation Solution
A method for checking the interface by coupling a test device to a bundle of electrical lines, applying a test signal, and comparing the response signal with a predetermined one to detect defects, allowing for independent verification of signal connection without requiring the cooling system or other operational systems to be ready.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the interface is checked only after the lithography apparatus is constructed in a high state of integration, then the system can be tested under operational conditions, but the troubleshooting becomes highly burdensome and requires dismantling of the complex system
Solution Approach 1:
The patent applies preliminary action by enabling interface checking before the lithography apparatus is fully constructed and integrated. The test device can be connected to the interface bundle at an intermediate stage, allowing defects to be detected and corrected before the system reaches its final high-state-of-integration configuration. This eliminates the need for burdensome dismantling and troubleshooting after construction.
2Temperature
If the water cooling system is integrated early in the construction process, then the electronics can be cooled during assembly, but the system complexity increases and operational testing is delayed
Solution Approach 1:
The patent enables preliminary testing of the interface and electronics before the water cooling system is fully integrated and operational. The test device can verify electrical signal transmission and interface connectivity at an intermediate construction stage, allowing defects to be identified and corrected before the cooling system is activated, thus avoiding delays in operational testing.
3Ease of operation
If multiple cable bundles and plug connectors are used to connect electronics in vacuum housing, then signal transmission is enabled, but the probability of defects increases and troubleshooting becomes more difficult
Solution Approach 1:
The patent applies preliminary action by providing a test device that can be connected to the interface bundle at an intermediate construction stage to verify the correctness of cable connections and plug connectors before final system integration. This early verification reduces the probability of defects slipping into the final system and simplifies troubleshooting by identifying connection issues before they become part of the complex integrated assembly.
Data Source
AI summary
A method for checking an interface for the wired transmission of electrical signals to an electronics unit, arranged in a vacuum-tight housing, of an optics module comprises: a) coupling a first bundle of the interface to the electronics unit; b) connecting a test device to a free end of the first bundle; c) applying an electrical test signal generated by the test device to a specific pair of electrical lines of the first bundle; d) acquiring an electrical response signal from the specific pair of electrical lines; e) comparing the acquired response signal with a response signal predetermined for the specific pair, and f) determining whether a defect is present in one of the electrical lines of the pair on the basis of the comparison.