EUV Mask Adhesive Removal via Acid-Base Reaction
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Solution Overview
Problem
Existing adhesives for EUV masks are difficult to remove efficiently, which hampers the reuse of EUV masks and can damage the mask surface during cleaning.
Innovation Solution
An adhesive for EUV masks comprising an epoxy resin composition (50 wt % to 80 wt %) and an inorganic filler (20 wt % to 50 wt %), which can be easily removed using a cleaning solution containing water and a strong acid, promoting adsorption and acid-base reactions for effective detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If existing adhesive is used to attach EUV pellicle to EUV mask, then strong adhesion is achieved, but removal becomes difficult and may damage mask surface
Solution Approach 1:
The adhesive is formulated as a composite material containing inorganic filler particles (such as silica, aluminum oxide, or titanium oxide) dispersed in an organic polymer matrix. This composite structure provides strong initial adhesion while enabling controlled removal through chemical treatment that targets the organic component, leaving the inorganic filler to facilitate clean detachment without damaging the EUV mask surface.
Solution Approach 2:
The adhesive's chemical and physical parameters are specifically designed to change under certain conditions. The formulation includes components that remain stable during attachment but undergo controlled chemical transformation when exposed to specific solvents or environmental conditions, allowing the adhesive to transition from a strong bonding state to a removable state without damaging the mask.
2Productivity
If strong acid is used to remove adhesive, then removal efficiency improves, but risk of mask surface damage increases
Solution Approach 1:
The inorganic filler particles serve as an intermediary between the adhesive and the EUV mask surface. These particles create a physical and chemical buffer that allows the adhesive to be removed through milder chemical treatments rather than requiring strong acids, thereby maintaining removal efficiency while protecting the mask surface from damage.
Solution Approach 2:
The adhesive is designed as a temporary, disposable bonding agent that is intentionally made easy to remove. By incorporating removable inorganic fillers and environmentally responsive polymers, the adhesive fulfills its temporary bonding function and then can be completely eliminated without trace or damage, enabling mask reuse.
3Adaptability or versatility
If adhesive composition is optimized for easy removal, then mask reuse becomes feasible, but adhesion strength may be compromised
Solution Approach 1:
The adhesive exhibits dynamic properties that allow it to adapt its characteristics based on environmental conditions. During attachment, it maintains strong bonding through its polymer matrix structure. During removal, exposure to specific humidity levels, temperatures, or chemical environments triggers controlled degradation of the polymer while the inorganic filler remains intact, enabling mask reuse without compromising initial adhesion strength.
Solution Approach 2:
The adhesive formulation preliminarily incorporates removable inorganic filler particles and environmentally responsive components that are designed to facilitate future removal. This preliminary design ensures that while the adhesive provides strong initial bonding, it also contains built-in mechanisms that enable clean removal and mask reuse without requiring aggressive cleaning procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive allows for easy and effective removal without damaging the EUV mask, enabling repeated use and reducing the cost of EUV lithography processes.
Implementation Method 1
swelling the adhesive includes an adsorption reaction in which the inorganic filler and the water are adsorbed to each other
Implementation Method 2
removing the swollen adhesive includes an acid-base reaction between the inorganic filler and the strong acid
Data Source
AI summary
An adhesive for an EUV mask includes an epoxy resin composition in an amount of 50 wt % to 80 wt % based on a total weight of the adhesive, the epoxy resin composition including an epoxy resin, a hardener, a toughening agent, a filler, and a curing accelerator, and an inorganic filler in an amount of 20 wt % to 50 wt % based on the total weight of the adhesive, the inorganic filler including one or more of aluminum hydroxide or calcium carbonate.