EUV Mask Critical Dimension Adjustment via Laser-Induced Chemical Etching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods are ineffective for adjusting the critical dimension of patterns on extreme ultraviolet (EUV) masks, as they rely on light transmission, which is not applicable due to EUV light absorption, making it difficult to modify the pattern dimensions using laser irradiation techniques employed for deep ultraviolet (DUV) masks.
Innovation Solution
A mask treatment apparatus and method that includes a support unit, a light irradiation unit with a digital micro-mirror device (DMD) for forming irradiation patterns, and a chemical liquid supply unit to form a liquid film on the EUV mask, allowing for precise adjustment of pattern dimensions by controlling the laser beam and chemical etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If laser beam irradiation is used to adjust critical dimension of patterns on DUV masks, then pattern dimension adjustment is achieved, but the method cannot be applied to EUV masks due to EUV light absorption
Solution Approach 1:
The patent introduces a liquid film as an intermediary medium between the laser beam and the EUV mask. The liquid film absorbs the laser beam energy and converts it to thermal energy, which then facilitates chemical etching of the mask pattern. This intermediary approach allows indirect laser interaction with the mask, overcoming the fundamental limitation of EUV light absorption while enabling effective pattern adjustment.
Solution Approach 2:
The patent replaces the direct optical-mechanical interaction (laser beam directly modifying the mask through thermal expansion or ablation) with a chemical process. By using laser-induced thermal energy to drive chemical etching reactions in the liquid film, the system achieves pattern adjustment through chemical means rather than direct physical or optical-mechanical means, making it applicable to EUV masks.
2Manufacturing precision
If a new mask is manufactured to adjust critical dimension, then desired pattern size is achieved, but the high cost of mask manufacturing makes this approach inappropriate
Solution Approach 1:
The patent performs preliminary actions by forming a liquid film on the mask surface before laser irradiation. This liquid film serves as a removable intermediate layer that enables selective chemical etching. The preliminary formation of this film allows subsequent pattern adjustment through controlled chemical reactions, providing a cost-effective alternative to complete mask replacement while achieving precise critical dimension control.
Solution Approach 2:
The patent changes the physical and chemical parameters of the mask surface by introducing a liquid film with specific chemical properties. This parameter change enables selective chemical etching at controlled rates, allowing precise adjustment of critical dimensions. By manipulating chemical concentration, temperature, and exposure time parameters, the system achieves accurate pattern modification without the high cost of remanufacturing entire masks.
3Manufacturing precision
If chemical liquid is supplied to form liquid film on mask, then laser beam can effectively adjust pattern, but additional equipment and process complexity are required
Solution Approach 1:
The patent integrates multiple functions into a unified system. The liquid film formation system serves dual purposes: it prepares the mask surface for laser irradiation and provides the chemical medium for pattern adjustment. The same apparatus infrastructure (chambers, delivery systems, control mechanisms) handles both liquid film formation and subsequent laser processing, reducing overall system complexity despite the added chemical processing capability.
Solution Approach 2:
The patent merges the liquid film formation process with the laser irradiation process into a single integrated treatment chamber. Both functions share common infrastructure including positioning systems, control mechanisms, and safety protocols. By combining these processes spatially and operationally, the system achieves precise pattern adjustment while minimizing the increase in device complexity through shared resources and coordinated operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective adjustment of critical dimensions on EUV masks by forming specific irradiation patterns and etching regions, overcoming the limitations of traditional methods by using a combination of laser beam modulation and chemical etching, thus improving pattern precision and accuracy.
Implementation Method 1
a light irradiation unit that irradiates the mask with a light to adjust a critical dimension of a pattern formed in the mask
Implementation Method 2
the pattern may be irradiated with a laser beam. Further, to decrease the critical dimension of the pattern, a crack may be formed in the region around the pattern by irradiating the region around the pattern with a laser beam
Implementation Method 3
a light modulation element that modulates the light generated by the light source and forms an irradiation pattern
Implementation Method 4
a chemical liquid supply unit to form a liquid film on the EUV mask, allowing for precise adjustment of pattern dimensions
Implementation Method 5
When the crack is formed in the region around the pattern, the region around the pattern is thermally expanded, and thus the critical dimension of the pattern may be reduced
Data Source
AI summary
The inventive concept provides a mask treatment apparatus. The mask treatment may include a support unit that supports the mask, and a light irradiation unit that irradiate the mask with a light to adjust a critical dimension of a pattern formed in the mask, wherein the light irradiation unit includes a light source that generates the light, and a light modulation element that modulates the light generated by the light source and forms an irradiation pattern.


