EUV Reflective Mask Phase Shift Absorber Blind Area Removal

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Solution Overview

Problem

In EUV lithography, the use of halftone masks leads to unintended sensitization of resist films due to overlapping between transfer patterns and leakage light areas, as reflected light from the absorber film in the leakage light area can expose regions that should not be sensitized.

Innovation Solution

A reflective mask with a phase shift absorbing film and a multilayer reflective film structure where the multilayer reflective film is removed from the upper layer in the blind area, including the leakage light area, to reduce reflectance and prevent sensitization of the resist film, and a conductive film is interposed between the substrate and the multilayer reflective film for grounding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a halftone mask with absorber film is used in EUV lithography, then the mask contrast is improved, but unintended sensitization of resist films occurs due to reflected light from the absorber film in the leakage light area

Engineering Contradiction:
Improvemask contrastVSAvoidunintended sensitization of resist film
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The patent removes the multilayer reflective film from the blind area including the leakage light area, extracting only the necessary reflective structure from the mask. This eliminates the source of harmful reflected light in the leakage area while preserving the phase shift effect in the transfer area, thereby preventing unintended resist sensitization without sacrificing mask contrast

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent applies different structures to different areas of the mask: the transfer area retains both the absorber film and multilayer reflective film to achieve phase shift and high contrast, while the blind area (including leakage light area) has only the absorber film without the multilayer reflective film to eliminate harmful reflections. This local differentiation resolves the contradiction between maintaining mask contrast and preventing unintended sensitization

Inventive Principle:
Principle #3Local quality

2Object-affected harmful factors

If the multilayer reflective film is removed from the blind area, then the harmful reflected light is reduced, but the grounding of the multilayer reflective film becomes difficult

Engineering Contradiction:
Improvereflected light in blind areaVSAvoidgrounding of multilayer reflective film
Core Design Contradiction:
Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent segments the multilayer reflective film structure by removing it only from the blind area while retaining it in the transfer area. This segmentation allows the mask to have different functional requirements met in different regions: the transfer area maintains full functionality including grounding capability, while the blind area eliminates harmful reflections

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The absorber film serves multiple functions: it acts as a phase shift element in the transfer area when combined with the multilayer reflective film, and it serves as the sole reflective control layer in the blind area where the multilayer structure is removed. This multi-functionality allows the absorber film to maintain electrical connectivity for grounding purposes even when the multilayer reflective film is removed from certain areas

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration suppresses the sensitization of resist films at overlapping portions between the low-reflection portion and the leakage light area, ensuring accurate pattern transfer without unwanted exposure, and facilitates easy grounding of the multilayer reflective film to prevent electrostatic charging.

Implementation Method 1

a multilayer reflective film (13) formed on the conductive film (12) in the transfer area (1)

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 2

having a structure in which high refractive index layers and low refractive index layers are alternately laminated

Methodology Applied
Scientific EffectInterference: Interference

Implementation Method 3

an absorbing film (15) formed on the multilayer reflective film (13) and adapted to absorb EUV exposure light

Methodology Applied
Scientific EffectAbsorption (EM radiation): Absorption (EM radiation)

Implementation Method 4

a conductive film is interposed between the substrate and the multilayer reflective film for grounding

Methodology Applied
Scientific EffectConduction (electrical): Conduction (electrical)

Data Source

PatentUS8372564B2Reflective mask, reflective mask blank and method of manufacturing reflective mask
Publication Date: 2013.02.12 HOYA CORPORATION
  • US8372564B2 patent drawing
  • US8372564B2 patent drawing
  • US8372564B2 patent drawing

AI summary

A reflective mask of this invention includes a multilayer reflective film (13), on a substrate (11), having a structure in which high refractive index layers and low refractive index layers are alternately laminated, and an absorbing film (15) stacked on the multilayer reflective film (13) and adapted to absorb EUV exposure light. The absorbing film (15) is a phase shift film that allows the EUV exposure light having passed therethrough and reflected by the multilayer reflective film to have a predetermined phase difference with respect to the EUV exposure light directly incident on and reflected by the multilayer reflective film. A plurality of the layers or all the layers of the multilayer reflective film (13) in a blind area are removed from its upper layer.