EUV Mask Blank Processing Platform With Central Transfer and Flipping

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Solution Overview

Problem

Current multi-chamber substrate processing systems for EUV mask blanks suffer from high defect rates and increased operational costs due to multiple robotic handlers, manual hand-offs, and a large footprint, which complicates the deposition and annealing of multiple layers on both sides of substrates like EUV mask blanks.

Innovation Solution

A single substrate processing platform with a central transfer chamber and five surrounding processing chambers, including multi-cathode PVD chambers and an annealing chamber, utilizes a central robot and factory interface with a substrate flipping fixture to minimize robotic transfers and enable in-situ deposition on both sides of substrates, reducing defects and operational costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple robotic handlers and manual hand-offs are used to move mask blanks between chambers, then substrates can be processed in multiple chambers, but defect rates increase and yield decreases

Engineering Contradiction:

Improveability to process multiple layers on both sides of substratesVSAvoiddefect rate

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent consolidates multiple processing chambers (PVD chambers for front and back sides, annealing chambers) into a single integrated chamber that can perform all necessary operations. This eliminates the need for multiple robotic handlers and manual hand-offs, thereby reducing defect rates while maintaining the ability to process multiple layers on both sides of substrates.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The single processing chamber is designed with multi-functionality to perform deposition, annealing, and processing of both front and back sides of mask blanks. This universal chamber replaces multiple specialized chambers, reducing the complexity of substrate transfer operations and minimizing defect generation during handling.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Ease of manufacture

If multiple processing chambers are used for deposition and annealing, then complete processing can be achieved, but the footprint and operational cost increase

Engineering Contradiction:

Improvecomplete deposition and annealing capabilityVSAvoidsystem footprint

Core Design Contradiction:

Ease of manufactureVSArea of stationary object

Solution Approach 1:

The patent merges multiple processing chambers into a single integrated chamber that contains all necessary processing zones for deposition and annealing of both front and back sides. This consolidation achieves complete processing capability while dramatically reducing the system footprint compared to distributed multi-chamber configurations.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The single processing chamber is designed with nested functional zones that allow multiple processing operations to occur within a compact structure. Different deposition and annealing zones are arranged concentrically or in nested configurations, enabling complete processing capability within a small footprint.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Ease of operation

If a central robot designed for 300 mm substrates is used to process EUV substrates, then substrate transfer can be performed, but defect counts increase

Engineering Contradiction:

Improvesubstrate transfer capabilityVSAvoiddefect count

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The patent extracts the substrate transfer function from the processing chamber entirely by performing all operations within a single chamber. This eliminates the need for central robots and their associated defect generation, while still enabling complete processing of both front and back sides through in-chamber manipulation and flipping mechanisms.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces an intermediary flipping mechanism within the single processing chamber that allows the mask blank to be rotated and processed on both sides without external robot intervention. This intermediary device enables bidirectional processing while maintaining a defect-free environment.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly reduces defect generation and operational costs by allowing all necessary depositions and anneals in a single system with minimal robotic transfers, achieving high yield and low defect rates for EUV mask blanks and other substrates.

Implementation Method 1

at least two multi-cathode physical vapor deposition (PVD) chambers

Methodology Applied

Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Implementation Method 2

at least one substrate annealing chamber

Methodology Applied

Scientific EffectAnnealing: Annealing

Data Source

PatentUS11860528B2Multi-chamber substrate processing platform

Publication Date: 2024.01.02 APPLIED MATERIALS INC

AI summary

Substrate processing systems or platforms and methods configured to process substrates including of extreme ultraviolet (EUV) mask blanks are disclosed. Systems or platforms provide a small footprint, high throughput of substrates and minimize defect generation. The substrate processing system platform comprises a single central transfer chamber, a single transfer robot, a substrate flipping fixture, and processing chambers are positioned around the single central transfer chamber.