EUV Lithography Membrane Assembly Manufacturing Method
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Solution Overview
Problem
The manufacturing of pellicles for EUV lithography is challenging due to the difficulty in preventing deformation and damage during the process, particularly because of the thinness of the membrane, and the need for efficient production time reduction.
Innovation Solution
A method involving a supporting substrate with a membrane layer, where an attachment substrate is bonded to form a stack with the membrane encapsulated between them, and subsequent thinning to achieve a symmetrical structure, enhancing mechanical stability and reducing manufacturing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a thin membrane is used to create the pellicle, then the radiation transmission is improved, but the membrane becomes prone to deformation and damage during manufacturing
Solution Approach 1:
The manufacturing process is divided into distinct stages: first forming a support structure with opening, then selectively removing material to create the thin membrane in a controlled manner. This segmentation allows the membrane to be created with minimal mechanical stress and reduced risk of deformation or damage during fabrication.
Solution Approach 2:
A support structure is formed in advance with an opening defined before the membrane material is deposited or formed. This preliminary action provides a template that guides the subsequent membrane formation, ensuring the thin membrane is created in the correct location with proper thickness control, reducing variability and potential defects.
2Ease of manufacture
If conventional pellicle manufacturing methods are used, then the process is simple, but the manufacturing time is excessive and deformation/damage risk is high
Solution Approach 1:
Multiple manufacturing steps are merged into integrated process sequences. The support structure formation, opening definition, and membrane creation are combined into a unified manufacturing flow that reduces the total number of discrete steps, minimizes handling operations, and decreases overall manufacturing time while maintaining process simplicity.
Solution Approach 2:
Traditional mechanical manipulation methods are replaced with controlled material removal processes. Instead of physically handling and shaping the thin membrane through mechanical means (which causes deformation and damage), the invention uses selective etching or deposition processes that create the membrane structure in a controlled, contactless manner, significantly reducing manufacturing time and improving yield.
3Shape
If the membrane is made thinner to reduce deformation, then the manufacturing precision requirement increases
Solution Approach 1:
The support structure is designed with locally optimized properties: thicker regions provide mechanical support while thinner regions or openings allow membrane formation. This local variation in support structure thickness and geometry enables the creation of uniformly thin membranes with controlled precision, as the support structure compensates for potential variations in the membrane formation process.
Solution Approach 2:
The manufacturing process utilizes controlled changes in process parameters (such as etch rate, deposition thickness, or removal depth) to achieve precise membrane thickness control. By carefully adjusting and monitoring these parameters during fabrication, the thin membrane can be created with consistent thickness and minimal deformation, meeting the high precision requirements despite the membrane's thinness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the risk of deformation and damage during pellicle manufacturing, while also streamlining the production process, resulting in a more robust and efficient membrane assembly for EUV lithography.
Implementation Method 1
wafer bonding an attachment substrate (51) having an average thickness of less than 500 μm to the supporting substrate (41) provided with the membrane layer (45) to form a stack
Data Source
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AI summary
A method for manufacturing a membrane assembly (80) for EUV lithography, the method comprising: providing a stack (40) comprising a membrane layer (45) between a supporting substrate (41) and an attachment substrate (51), wherein the supporting substrate comprises an inner region and a first border region; processing the stack, including selectively removing the inner region of the supporting substrate, to form a membrane assembly comprising: a membrane (45) formed from at least the membrane layer; and a support (81) holding the membrane, the support formed at least partially from the first border region of the supporting substrate. The attachment substrate can be bonded to the rest of the stack.