EUV Reflection Mirror With Integrated Cooling Channel

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Solution Overview

Problem

As integrated circuit (IC) sizes shrink, achieving accuracy and reliability in multiple layer fabrication becomes increasingly difficult due to the challenges of extreme ultraviolet (EUV) lithography, where traditional reflection mirrors can deform and cause aberrations due to high energy EUV radiation, leading to reduced intensity and production issues.

Innovation Solution

A reflection mirror assembly with a channel for circulating a working fluid to maintain temperature uniformity, combined with a heat exchanger and potentially a heater, to prevent deformation and aberrations in the EUV lithography system, ensuring consistent performance and extended mirror lifetime.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional reflection mirrors are used in EUV lithography, then the system can reflect EUV radiation, but the mirrors deform and cause aberrations due to high energy EUV radiation

Engineering Contradiction:
Improvemirror stabilityVSAvoidpattern accuracy
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

A cooling fluid is introduced as an intermediary substance between the EUV radiation and the mirror. The fluid absorbs excess heat from the radiation before it reaches the mirror, preventing thermal deformation while allowing the mirror to maintain its reflective function

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The temperature parameter of the mirror is actively controlled by circulating cooling fluid through channels in the mirror substrate. This maintains the mirror at a stable temperature, preventing thermal expansion and deformation that would cause aberrations

Inventive Principle:
Principle #35Parameter changes

2Temperature

If cooling fluid is circulated through the reflection mirror, then temperature uniformity is maintained, but the device complexity increases

Engineering Contradiction:
Improvetemperature uniformityVSAvoidsystem complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The cooling channels are integrated directly into the mirror substrate structure, merging the optical component with the thermal management system. This eliminates the need for separate cooling apparatus and reduces overall system complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The mirror structure itself provides the cooling function through built-in channels that circulate fluid. The mirror serves dual purposes: optical reflection and thermal regulation, eliminating the need for external cooling systems

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution maintains temperature uniformity of the reflection mirrors, preventing deformation and aberrations, thereby increasing production capacity, improving product yield, and extending the lifetime of the mirrors while enhancing the performance of EUV radiation in photolithography processes.

Implementation Method 1

a working fluid is circulated through a channel in the reflection mirror to reduce a temperature difference between the first region and a second region of the reflection mirror

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

patterns representing different layers of the IC are fabricated using a series of reusable photomasks to transfer the design of each layer of the IC onto a semiconductor substrate during the manufacturing process in a photolithography process. The radiation used in the photolithography may be at any suitable wavelength

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentUS10613444B2Semiconductor apparatus and method of operating the same
Publication Date: 2020.04.07 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US10613444B2 patent drawing
  • US10613444B2 patent drawing
  • US10613444B2 patent drawing

AI summary

A semiconductor apparatus includes a light source, a reflection mirror, and a heat exchanger. The reflection mirror has a reflection surface configured to reflect a light of the light source and a channel behind the reflection surface. The heat exchanger is connected to the channel and configured to circulate a working fluid in the channel.