EUV Lithography Pellicle Boron Implantation Etch Uniformity
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Solution Overview
Problem
The uniformity of the pellicle layer in extreme ultraviolet lithography is compromised due to uneven etching during the manufacturing process, leading to image distortion and reduced yield.
Innovation Solution
A boron implantation layer with a specific concentration and thickness is introduced between the pellicle layer and the frame, acting as an etch stop layer to maintain uniform pellicle thickness and improve manufacturing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wet etching is used to expose the pellicle layer by bottom etching of the frame, then the pellicle layer can be exposed, but the edge area of the frame is etched faster than the central area causing non-uniform etching
Solution Approach 1:
The patent applies local quality by forming a boron implantation layer specifically in the edge area of the frame at a higher concentration than in the central area. This creates a gradient structure where the edge region has enhanced etch resistance through boron doping, while the central area maintains its original etching characteristics. The local modification of material properties (boron concentration) in the edge region compensates for the faster etching rate, achieving uniform pellicle layer exposure across the entire frame surface.
2Productivity
If the edge of the etching area is etched faster than the central area, then the pellicle layer on the edge is exposed first, but the pellicle layer on the edge becomes excessively etched
Solution Approach 1:
The patent implements preliminary anti-action by pre-doping the edge area of the frame with boron ions before the etching process. This preliminary modification creates a protective effect in advance, where the boron implantation in the edge region reduces the etching rate before the actual etching begins. As a result, during the etching process, the edge area etches at a similar rate to the central area, preventing excessive etching and ensuring uniform pellicle layer thickness across the entire structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The boron implantation layer ensures uniform pellicle thickness, preventing image distortion and enhancing the production yield of pellicle layers during extreme ultraviolet lithography processes.
Implementation Method 1
forming a boron implantation layer by implanting boron to a specific (or, alternatively, predetermined) thickness on a first surface of a substrate
Data Source
AI summary
A pellicle for extreme ultraviolet lithography and a method of manufacturing the pellicle for extreme ultraviolet lithography are provided. The pellicle for extreme ultraviolet lithography includes a pellicle layer having a specific (or, alternatively, predetermined) thickness, a frame on an edge area of the pellicle layer and supporting the pellicle layer, and a boron implantation layer located between the pellicle layer and the frame. The boron implantation layer is spaced by a specific (or, alternatively, predetermined) distance inward from an outer periphery of the pellicle layer.