EUV Pellicle Heat Radiation Layer Metal Silicon Ratio
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Solution Overview
Problem
EUV lithography pellicles face challenges in heat dissipation due to increased EUV light power, leading to reduced mechanical strength and transmittance issues, as existing designs struggle to effectively manage heat generated during high-power EUV exposure.
Innovation Solution
A pellicle with a heat radiation layer composed of a higher metal-to-silicon ratio (1:0.6-0.99 at%), incorporating metals like Mo, V, Pd, and Si, along with auxiliary and capping layers to enhance thermal radiation and mechanical strength, ensuring 90% or more transmittance for EUV exposure light up to 600W.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the power of EUV light is increased to over 600W to improve productivity, then the productivity of the lithography process is improved, but the heat generated in the pellicle film increases, reducing mechanical strength and causing film breakage
Solution Approach 1:
The patent changes the compositional parameters of the heat radiation layer by adjusting the metal-to-silicon ratio to greater than 1:1 (e.g., Mo:Si = 1:0.6-0.99), which fundamentally alters the thermal radiation properties of the material. This parameter change enables effective heat dissipation at high EUV power levels while maintaining film integrity and mechanical strength
Solution Approach 2:
The patent employs composite material structure consisting of a heat radiation layer (metal + silicon) combined with a capping layer (e.g., SiO2, SiN). This composite structure synergistically combines the heat radiation capability of the metal-silicon layer with the protective and hydrogen radical resistance properties of the capping layer, enabling both high heat dissipation performance and maintained mechanical strength under 600W EUV irradiation
2Productivity
If the power of EUV light is increased to over 600W to improve productivity, then the productivity of the lithography process is improved, but the transmittance of the pellicle film deteriorates due to heat generation
Solution Approach 1:
The patent optimizes the thickness parameter of the heat radiation layer to 15nm or less, and the overall pellicle thickness to 30nm or less. These parameter changes minimize the absorption of EUV light while maintaining sufficient heat radiation capability, thereby preserving high transmittance (90% or more) even at 600W EUV power levels
Solution Approach 2:
The patent applies local quality by creating a multi-layer structure where different layers have specialized functions: the heat radiation layer (metal + silicon) is optimized for thermal management, while the capping layer (e.g., SiO2, SiN) is optimized for EUV transmittance and hydrogen radical resistance. This local optimization of each layer's properties enables simultaneous achievement of high heat dissipation and high transmittance
3Temperature
If a pellicle with high metal content is used to improve heat radiation performance, then thermal radiation performance is improved, but the optical transmittance may be reduced
Solution Approach 1:
The patent precisely controls the thickness parameter of the heat radiation layer to 15nm or less, and optimizes the metal-to-silicon ratio to greater than 1:1 (e.g., 1:0.6-0.99). These parameter changes create an optimal balance where the metal content is sufficient for heat radiation but the overall thickness is controlled to maintain high EUV transmittance of 90% or more
Solution Approach 2:
The patent implements local quality by assigning different functional roles to different layers: the heat radiation layer (with high metal content) is specifically optimized for thermal management, while the capping layer is optimized for EUV transmittance. This functional separation allows the metal-rich layer to excel at heat radiation without compromising overall optical performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved thermal radiation performance and mechanical strength of the pellicle enable effective heat dissipation and high transmittance, addressing the limitations of existing designs under increased EUV light power conditions.
Implementation Method 1
a heat radiation layer for radiating heat generated by irradiation of EUV exposure light
Data Source
Figure 1~3
AI summary
The pellicle has a pellicle portion that allows transmission of EUV exposure light. The pellicle portion comprises a heat radiation layer for radiating heat generated by irradiation of EUV exposure light. The heat radiation layer comprises metal and silicon, and the metal content of the heat radiation layer is greater than the silicon content. This ensures a high transmittance of 90% or more, while improving the heat radiation performance of the pellicle portion, so that it can be applied to EUV exposure light powers of 600W or more.