EUV Pellicle with Nanometer Protection Layers
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Solution Overview
Problem
EUV light used in semiconductor lithography processes often contaminates pellicles, leading to reduced productivity due to frequent replacements and potential defects in substrate manufacturing.
Innovation Solution
A mask with a pellicle featuring nanometer-thick protection layers, potentially made of graphite or graphene, supported by carbon nano-tubes, and a pellicle repairing apparatus with a chamber, detector, and decontamination system to remove contaminants, allowing for the pellicle's reuse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pellicle is used to protect mask patterns, then the mask patterns are protected from contamination, but the pellicle itself becomes contaminated by EUV light and must be frequently replaced
Solution Approach 1:
The pellicle is segmented into multiple thin layers (first pellicle layer, second pellicle layer, third pellicle layer) rather than using a single thick layer. This segmentation allows the decontamination apparatus to selectively remove contaminants from specific layers while preserving the overall pellicle structure, extending its usable life and reducing replacement frequency.
Solution Approach 2:
Instead of discarding the entire pellicle when contaminated, the invention recovers the pellicle by selectively removing only the contaminated outer layers using the decontamination apparatus. This allows the underlying clean layers to continue protecting the mask patterns, thereby recovering value from the pellicle and reducing replacement needs.
2Use of energy by moving object
If the pellicle thickness is reduced to nanometer scale, then EUV light transmission is improved, but the pellicle becomes more susceptible to contamination and damage
Solution Approach 1:
The pellicle is constructed as a composite structure with multiple layers of different materials (carbon, silicon oxide, silicon nitride) each with specific thicknesses in the nanometer range. This composite structure optimizes EUV light transmission while providing distributed protection against contamination, as each layer contributes different protective properties.
Solution Approach 2:
The pellicle is pre-configured with multiple protective layers before exposure to EUV light. The outer layers are designed to be sacrificial, absorbing contamination before it reaches the critical mask patterns. This preliminary protective arrangement allows the thin nanometer-scale structure to maintain both transmission efficiency and contamination resistance.
3Object-affected harmful factors
If a single thick pellicle layer is used, then contamination protection is improved, but EUV light transmission and resolution are degraded
Solution Approach 1:
The single thick pellicle layer is segmented into multiple thin layers (first, second, and third pellicle layers with thicknesses of 1-10 nm each). This segmentation maintains adequate contamination protection through the cumulative thickness of multiple layers while ensuring that each individual layer remains thin enough to allow high EUV light transmission and preserve pattern resolution.
Solution Approach 2:
Different material compositions are used for each pellicle layer (carbon, silicon oxide, silicon nitride) to optimize both protection and transmission properties. The composite structure provides enhanced contamination resistance through material diversity while maintaining nanometer-scale thickness for optimal EUV light transmission and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively extends the pellicle's lifespan by removing contaminants, reducing the need for frequent replacements and enhancing productivity in substrate manufacturing by ensuring consistent EUV beam transmission and minimizing defects.
Implementation Method 1
a decontamination part fusing at least one of the contaminant and the protection layers
Data Source
AI summary
Provided is a mask. The mask may include a mask substrate, mask patterns on the mask substrate, frames disposed on an edge of the mask substrate outside the mask patterns, and a pellicle spaced apart from the mask patterns, the pellicle being disposed on the frames, wherein the pellicle includes protection layers each of which has a nanometer thickness.


