EUV Photomask Capping Layer Repair Using Electron Beam Deposition

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Solution Overview

Problem

EUV photomasks suffer from capping layer damage due to aggressive cleaning methods, leading to reflectivity loss and non-uniformity, necessitating frequent replacement and increased costs.

Innovation Solution

A method for repairing the damaged capping layer using scanning electron microscopy and atomic force microscopy to identify and measure damage, followed by focused electron beam deposition of a Ru complex-containing precursor gas to form a capping patch layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If aggressive cleaning methods are used to clean EUV photomasks, then cleaning effectiveness is improved, but capping layer damage increases

Engineering Contradiction:
Improvecleaning effectivenessVSAvoidcapping layer integrity
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent converts the harmful effect of aggressive cleaning (which causes capping layer damage) into a beneficial repair process by using focused electron beam-induced deposition to selectively restore damaged regions. The cleaning process is allowed to be aggressive for thorough cleaning, and the damage is subsequently repaired through a controlled deposition process that targets only the affected areas, thereby converting the harm into an opportunity for localized reinforcement.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

2Reliability

If frequent photomask replacement is performed to maintain quality, then product quality is maintained, but manufacturing costs increase

Engineering Contradiction:
Improvephotomask qualityVSAvoidmanufacturing cost efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

Instead of discarding photomasks that show signs of wear or damage, the patent implements a recovery process where damaged capping layers are repaired through focused electron beam deposition. This allows photomasks to be restored to their functional specifications and continue being used, thereby recovering value from what would otherwise be discarded components and reducing the frequency of replacement.

Inventive Principle:
Principle #34Discarding and recovering

3Ease of repair

If traditional repair methods are used, then repair simplicity is maintained, but repair effectiveness is insufficient

Engineering Contradiction:
Improverepair process simplicityVSAvoidcapping layer restoration quality
Core Design Contradiction:
Ease of repairVSManufacturing precision

Solution Approach 1:

The repair process utilizes the photomask's own structure and properties to guide the repair. The focused electron beam automatically interacts with the damaged regions, and the deposition process is self-regulating based on the local conditions of the capping layer. This self-service approach maintains simplicity while achieving high precision, as the system adapts to the specific damage patterns without requiring complex external control mechanisms.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Extends the lifespan of EUV photomasks, reduces scrap rates, and lowers overall costs by effectively repairing the capping layer, maintaining reflectivity and uniformity.

Implementation Method 1

forming the capping patch layer in the damaged region of the capping layer using a focused electron beam

Methodology Applied
Scientific EffectFocused electron beam deposition: Electron Beam

Data Source

PatentUS20250362590A1Methods of repairing extreme ultraviolet photomasks
Publication Date: 2025.11.27 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20250362590A1 patent drawing
  • US20250362590A1 patent drawing
  • US20250362590A1 patent drawing

AI summary

A method for repairing a lithography mask is provided. The method includes receiving a lithography mask having a capping layer that includes a damaged region, identifying a location and a dimension of the damaged region of the capping layer, determining a repairing time duration based on the dimension of the damaged region of the capping layer, and forming a capping patch layer in the damaged region of the capping layer.