EUV Photosensitive Composition Resin for Bridge Defect Suppression
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Solution Overview
Problem
Current methods for manufacturing semiconductor devices using extreme ultraviolet (EUV) light struggle to achieve both good Z-factor performance and suppression of bridge defects simultaneously, as they often compromise on resolution, line edge roughness, and sensitivity.
Innovation Solution
A photosensitive composition for EUV light is developed, comprising a resin with increased polarity for enhanced alkali developer solubility and decreased organic solvent solubility, along with a photoacid generator, which includes a cationic and anionic moiety, to improve absorption efficiency and acid generation, thereby optimizing Z-factor and reducing bridge defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional photosensitive compositions are used for EUV lithography, then manufacturing process is simple, but bridge defects occur and Z-factor performance is insufficient
Solution Approach 1:
The patent uses a composite resin system combining polycyclic terpene derivatives and aromatic hydrocarbon derivatives, creating a multi-component photosensitive composition that achieves both bridge defect suppression and improved Z-factor performance while maintaining manufacturing simplicity
Solution Approach 2:
The patent optimizes specific parameters including the ratio of polycyclic terpene derivative (5-50 mass%) to aromatic hydrocarbon derivative (50-95 mass%), glass transition temperature (90-150°C), and acid dissociation constant (pKa ≤ 13) to simultaneously achieve bridge defect suppression and high Z-factor performance
2Manufacturing precision
If exposure dose is increased to improve pattern formation, then sensitivity improves, but bridge defects increase and resolution deteriorates
Solution Approach 1:
The patent changes the chemical parameters of the photosensitive composition, specifically using resins with controlled glass transition temperatures (90-150°C) and acid dissociation constants (pKa ≤ 13), enabling high-resolution pattern formation at reduced exposure doses while suppressing bridge defects
Solution Approach 2:
The patent introduces localized polar groups (carboxyl, hydroxyl, or fluorine atoms) at specific positions in the resin molecules to enhance acid generation efficiency and improve line edge roughness without requiring increased exposure dose
3Manufacturing precision
If resin polarity is increased to enhance alkali developer solubility, then development performance improves, but organic solvent solubility decreases affecting coating quality
Solution Approach 1:
The patent balances resin polarity by controlling the type and position of polar groups (carboxyl, hydroxyl, or fluorine atoms), achieving sufficient alkali developer solubility for good development performance while maintaining adequate organic solvent solubility for uniform coating formation
Solution Approach 2:
The patent combines polycyclic terpene derivatives with aromatic hydrocarbon derivatives in specific ratios, creating a composite system where the aromatic component provides coating processability while the polycyclic component with polar groups provides development performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively enhances the Z-factor, improving resolution, line edge roughness, and sensitivity while suppressing bridge defects, by increasing absorption efficiency and utilizing EUV light effectively without increasing exposure dose.
Implementation Method 1
a photoacid generator, or a resin that has a repeating unit having a photoacid generating group
Implementation Method 2
a resin that has an increased polarity by action of an acid, thereby having an increased solubility in an alkali developer
Implementation Method 3
by increasing absorption efficiency and utilizing EUV light effectively without increasing exposure dose
Data Source
AI summary
A photosensitive composition for EUV light includes a predetermined resin and a photoacid generator, or includes a predetermined resin having a repeating unit having a photoacid generating group, and satisfies Requirements 1 to 3,Requirement 1: The A value determined by Formula (1) is 0.14 or more,A=([H]×0.04+[C]×1.0+[N]×2.1+[O]×3.6+[F]×5.6+[S]×1.5+[I]×39.5)/([H]×1+[C]×12+[N]×14+[O]×16+[F]×19+[S]×32+[I]×127) Formula(1)Requirement 2: The concentration of solid contents in the photosensitive composition for EUV light is 5.0% by mass or less,Requirement 3: The content of the photoacid generator is 5% to 50% by mass with respect to the total solid content in the photosensitive composition for EUV light.