EUV Resist Composition for High Sensitivity and Resolution
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Solution Overview
Problem
Current methods for semiconductor device manufacturing using electron beams or EUV rays fail to simultaneously achieve high sensitivity, high resolution, and good pattern formation, leading to unsatisfactory results in fine processing, particularly in the super fine processing region.
Innovation Solution
A pattern-forming method utilizing an actinic ray-sensitive or radiation-sensitive resin composition with an acid-decomposable repeating unit, which decreases solubility in an organic solvent upon acid action, and is developed using a developer containing an organic solvent, allowing for improved sensitivity and resolution while maintaining pattern quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chemical amplification positive resist composition comprising phenolic acid-decomposable resin and acid generator is used to increase sensitivity, then sensitivity is improved, but pattern form and resolution deteriorate
Solution Approach 1:
The patent changes the chemical parameters of the resist composition by introducing a specific copolymer containing carboxyl groups and acid-decomposable groups. This copolymer has a unique structure where the ratio of acid-decomposable groups to carboxyl groups is controlled (0.3-2.0), enabling simultaneous achievement of high sensitivity and good pattern form through precise parameter optimization
Solution Approach 2:
The patent creates a composite resist composition system combining: (1) phenolic acid-decomposable resin for sensitivity, (2) copolymer with carboxyl and acid-decomposable groups for pattern form control, and (3) acid generator for chemical amplification. This composite approach balances the trade-off between sensitivity and resolution
2Reliability
If conventional alkali developer is used with acid-decomposable resin, then sensitivity is increased, but residual film remains and pattern quality deteriorates
Solution Approach 1:
The patent introduces a copolymer containing both carboxyl groups and acid-decomposable groups as an intermediary substance. This copolymer acts as a mediator that facilitates complete dissolution of exposed regions while maintaining unexposed region integrity, eliminating residual film without sacrificing sensitivity
Solution Approach 2:
The patent optimizes the ratio of acid-decomposable groups to carboxyl groups in the copolymer (0.3-2.0) to achieve optimal balance between dissolution efficiency and pattern fidelity, eliminating residual film while maintaining high sensitivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively enhances sensitivity, resolution, and pattern formation, achieving better performance in fine processing by using a resin composition that reduces solubility in organic solvents and employing a developer with specific organic solvents to improve the pattern-forming process.
Implementation Method 1
a compound capable of generating an acid upon irradiation with actinic rays or radiation
Implementation Method 2
a resin which contains an acid-decomposable repeating unit and is capable of decreasing the solubility in an organic solvent by the action of an acid
Implementation Method 3
developing the film with a developer containing an organic solvent
Data Source
AI summary
Provided is a pattern-forming method comprising, in the following order, the steps of (1) forming a film with an actinic ray-sensitive or radiation-sensitive resin composition; (2) exposing the film with an electron beam or an EUV ray; and (4) developing the film with a developer containing an organic solvent, the concentration of the organic solvent in the developer being 90% by mass or more, wherein the actinic ray-sensitive or radiation-sensitive resin composition comprises (A) a resin containing an acid-decomposable repeating unit and being capable of decreasing the solubility in an organic solvent by the action of an acid; (B) a compound generating an acid upon irradiation with an actinic ray or radiation; and (C) a solvent, wherein the resin (A) is a resin containing a repeating unit represented by the following formula (1) and a repeating unit represented by the following formula (AI): wherein A represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, or a cyano group; R represents a halogen atom, an alkyl group, a cycloalkyl group, an aryl group, an alkenyl group, an aralkyl group, an alkoxy group, an alkylcarbonyloxy group, an alkylsulfonyloxy group, an alkyloxycarbonyl group or an aryloxycarbonyl group, and when two or more R's are present, each R may be the same as or different from every other R or when two or more R's are present, they may form a ring in combination with each other; a represents an integer of 1 to 3; and b represents an integer of 0 to (3-a); wherein Xa1 represents a hydrogen atom or an alkyl group; T represents a single bond or a divalent linking group; and each of Rx1, Rx2 and Rx3 independently represents an alkyl group or a cycloalkyl group, and Rx2 and Rx3 may be bonded to each other to form a cyclic structure; and wherein the content of the repeating unit represented by the formula (1) in the resin (A) is 5 to 20 mol% based on all the repeating units.