EUV Resist Semi-Solid Film LWR Reduction
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Solution Overview
Problem
Current substrate processing methods for semiconductor devices face challenges in achieving both improved line width roughness (LWR) and productivity, particularly in forming finer resist patterns during the exposure process.
Innovation Solution
A substrate processing method involving the formation of a semi-solidified film by volatilizing the solvent from a resist coating film without heating, followed by exposure to EUV light and subsequent development, which allows for uniform solubility and reduced line width roughness, and eliminates the need for a heating source, thereby simplifying the process and saving energy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resist coating film is solidified by heating (PAB) before exposure, then the film structure is stabilized, but the manufacturing precision (LWR) deteriorates and energy consumption increases
Solution Approach 1:
The patent changes the physical state parameter of the resist coating film from fully solidified (by heating) to semi-solidified state. By controlling the solvent removal process without applying heat, the film maintains a semi-solidified state that allows uniform EUV light penetration and consistent developer solubility, thereby reducing LWR while eliminating the need for heating equipment and reducing energy consumption.
2Reliability
If a resist coating film is solidified by heating before exposure, then the film structure is stabilized, but the energy consumption and process complexity increase
Solution Approach 1:
The patent extracts the heating step from the traditional resist processing sequence. By removing the PAB heating process and relying solely on solvent volatilization to achieve film stabilization, the method eliminates energy consumption associated with heating equipment while maintaining sufficient film structure stability for high-precision patterning.
3Reliability
If a resist coating film is solidified by heating before exposure, then the film structure is stabilized, but the processing time increases
Solution Approach 1:
The patent performs solvent volatilization and film stabilization as a preliminary action during the coating process itself, rather than requiring a separate post-coating heating step. The resist coating film is formed and simultaneously stabilized through controlled solvent removal, allowing the film to be ready for exposure without additional processing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves improved LWR and increased productivity by ensuring uniform EUV light exposure and solubility, allowing for finer line widths with reduced energy consumption and processing time.
Implementation Method 1
forming a semi-solidified film by volatilizing a solvent contained in the coating film without heating
Implementation Method 2
irradiating the semi-solidified film with EUV light to expose the semi-solidified film
Data Source
AI summary
A substrate processing method includes: forming a coating film on a substrate by supplying a resist liquid which is photosensitive to extreme ultraviolet (EUV) light to a surface of the substrate; forming a semi-solidified film by volatilizing a solvent contained in the coating film without heating the solvent; irradiating the semi-solidified film with EUV light thereby exposing the semi-solidified film with EUV light; and supplying a developer to the substrate after the exposure of the semi-solidified film.