EUV Reticle Pod Support Layout to Reduce Gravity Deformation

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Solution Overview

Problem

Reticles used in EUV photolithography experience bending, stress, and deformation due to gravity when suspended horizontally, particularly with larger dimensions, which can affect manufacturing yield.

Innovation Solution

The inner reticle pod design includes reticle supports and contact surfaces positioned at side locations to minimize stress and deformation by distributing support evenly across the reticle, using a reduced number of contact points and maintaining the reticle in a flat position.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If reticle supports are positioned at corner locations only, then the structure is simple, but the reticle experiences bending and deformation due to gravity

Engineering Contradiction:
Improvereticle support structureVSAvoidreticle flatness
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The reticle support structure is segmented into multiple support surfaces distributed across the base, including corner supports and additional side supports. This segmentation allows the reticle to be supported at multiple locations, preventing bending while maintaining structural simplicity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the base are assigned different support functions: corner supports provide structural anchoring while side supports provide gravitational counterbalance. This local differentiation of support functions optimizes reticle flatness without requiring complex overall structure.

Inventive Principle:
Principle #3Local quality

2Device complexity

If reticle supports are spaced apart to simplify structure, then device complexity is reduced, but the reticle sags or bows due to gravity

Engineering Contradiction:
Improvereticle support arrangementVSAvoidreticle position stability
Core Design Contradiction:
Device complexityVSStability of the object's composition

Solution Approach 1:

The support arrangement is segmented into multiple discrete support surfaces positioned at strategic locations (corners and sides). This segmentation provides distributed support that prevents sagging while keeping each individual support element simple and the overall arrangement easy to manufacture.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Side supports are positioned to counteract the gravitational force acting on the reticle. These supports act as counterweights that prevent the reticle from sagging or bowing, maintaining stability without requiring complex active control systems.

Inventive Principle:
Principle #8Anti-weight (Counterweight)

3Manufacturing precision

If reticle contact surfaces are added to support edges, then reticle deformation is reduced, but the number of contact points increases

Engineering Contradiction:
Improvereticle flatnessVSAvoidnumber of contact points
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

Contact surfaces are added only at specific locations where they are most needed (along the edges and at corners), rather than uniformly across the entire reticle. This localized addition of support features reduces deformation while minimizing the total number of contact points.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The design uses a partial set of contact surfaces positioned at critical locations (edges and corners) rather than complete coverage. This partial action is sufficient to prevent reticle deformation while keeping the overall structure simple and manageable.

Inventive Principle:
Principle #16Partial or excessive action

Data Source

PatentUS20250341773A1Reticle pod
Publication Date: 2025.11.06 ENTEGRIS INC
  • US20250341773A1 patent drawing
  • US20250341773A1 patent drawing
  • US20250341773A1 patent drawing

AI summary

Described are reticle pods used to support and transport a reticle in an extreme ultraviolet (EUV) lithography process.