EUV Reticle Thermal Feedback Control for Outgassing Reduction
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Solution Overview
Problem
Existing lithography techniques, particularly EUV lithography, face challenges in managing thermal conditions, leading to outgassing and contamination that affect the quality and yield of semiconductor fabrication, especially due to the formation of compounds like boron hydride and methylamine-borane, which degrade the reflectivity of EUV masks.
Innovation Solution
Implementing a thermal management system that monitors and actively controls thermal conditions within the EUV lithography apparatus, including zone-specific temperature regulation and gas supply, to reduce outgassing from the EUV mask and minimize contamination by managing the thermal environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If EUV lithography is performed without thermal management, then the lithography process can proceed, but outgassing and contamination occur that degrade mask reflectivity and affect fabrication quality
Solution Approach 1:
The patent applies thermal management by actively controlling and changing temperature parameters of the EUV mask and surrounding components. Temperature sensors monitor thermal conditions and control systems adjust heating or cooling to maintain optimal temperatures, preventing outgassing and contamination while ensuring fabrication quality.
Solution Approach 2:
The patent implements feedback control through temperature sensors that continuously monitor the thermal state of the EUV mask and lithography system. This feedback information is used to dynamically adjust thermal management systems, ensuring stable operating conditions that prevent contamination and maintain mask reflectivity.
2Object-generated harmful factors
If thermal management is implemented to reduce outgassing, then contamination is minimized, but device complexity increases due to additional monitoring and control systems
Solution Approach 1:
The patent divides the thermal management system into separate functional zones with independent temperature control. Different components (mask, substrate stage, optical elements) are monitored and controlled independently, allowing targeted thermal management that reduces contamination while limiting the complexity spread across the entire system.
Solution Approach 2:
The patent implements self-regulating thermal control where temperature sensors automatically detect thermal conditions and trigger appropriate responses without requiring constant external intervention. The system self-adjusts heating or cooling based on real-time temperature data, reducing the need for complex external control mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal management system effectively reduces outgassing and contamination, enhancing the quality and yield of semiconductor fabrication by maintaining optimal temperature conditions and reducing the formation of defect-inducing compounds on the EUV mask.
Implementation Method 1
providing a cooling effect to at least one component of the lithography system during a lithography process
Implementation Method 2
providing a heating effect to at least one component of the lithography system during a lithography process
Data Source
AI summary
A lithography system that includes one or more thermal sensors that provide feedback to a thermal management controller. The thermal management controller provides instructions to a thermal regulation component such as a heat exchanger and gas jets to provide cooling of a reticle used in the lithography system.