EUV Lithography Sensor Module for Mirror Alignment Monitoring

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Solution Overview

Problem

In extreme ultra-violet lithography systems, small errors in mirrors cause significant pattern formation errors due to the increased difficulty in the exposure process, necessitating precise monitoring of EUV light distribution.

Innovation Solution

A monitoring device comprising a sensor module and processor that generates and processes images to measure the intensity and alignment of EUV light across multiple mirrors, using Fourier transformations and algorithms to optimize the pupil region for precise alignment and intensity mapping.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If multiple mirrors are used in illumination and projection optical systems, then light transmission and pattern formation are enabled, but small errors in mirror alignment cause significant pattern formation errors

Engineering Contradiction:
Improvepattern formation precisionVSAvoidmirror alignment stability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent implements a feedback mechanism by placing sensor modules on the substrate stage to detect the actual position and alignment of EUV light after it passes through multiple mirrors. The detected information is fed back to a control system that adjusts mirror positions in real-time, compensating for alignment errors and maintaining pattern formation precision despite the complexity of the multi-mirror optical system.

Inventive Principle:
Principle #23Feedback

2Productivity

If EUV light is used for finer semiconductor circuit line widths, then shorter wavelength exposure is achieved, but the exposure process becomes increasingly difficult and sensitive to errors

Engineering Contradiction:
Improvesemiconductor circuit line width finenessVSAvoidexposure process complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent replaces complex mechanical alignment adjustments with a sensor-based detection and computational correction system. Instead of relying solely on precise mechanical mirror positioning, the system uses sensor modules to detect EUV light distribution and employs algorithms to calculate and correct alignment errors, substituting mechanical precision requirements with optical detection and computational processing.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Measurement precision

If mirror alignment is monitored to improve pattern formation, then measurement precision is enhanced, but the monitoring system complexity increases

Engineering Contradiction:
Improvemirror alignment measurement precisionVSAvoidmonitoring system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent introduces sensor modules as intermediary devices that indirectly measure mirror alignment by detecting the actual EUV light distribution pattern on the substrate stage. Instead of directly measuring mirror positions, the sensor modules capture light intensity information that reflects alignment status, providing a simplified measurement approach that maintains high precision while reducing the complexity of direct mechanical measurement systems.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables real-time monitoring and correction of EUV light intensity and alignment, reducing pattern formation errors by identifying and correcting misalignments and intensity losses in the illumination and projection optical systems.

Implementation Method 1

a sensor module which is disposed on a substrate stage that supports the substrate, and which generates a first image representing a light intensity distribution

Methodology Applied
Scientific EffectPhotoelectric Effect: Photoelectric Effect

Implementation Method 2

a processor performing a Fourier transformation on the first image to generate a second image representing a first pupil region defined by a first center point and a plurality of second center points

Methodology Applied
Scientific EffectFourier Transformation:

Implementation Method 3

a field facet mirror which includes a plurality of first mirrors that collect the light transmitted from the source module

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 4

a pupil facet mirror which includes a plurality of second mirrors that transmit the light transmitted from the field facet mirror to a reticle

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentUS20260064006A1Extreme ultra-violet lithography system having sensor module
Publication Date: 2026.03.05 SAMSUNG ELECTRONICS CO LTD
  • US20260064006A1 patent drawing
  • US20260064006A1 patent drawing
  • US20260064006A1 patent drawing

AI summary

An extreme ultra-violet (EUV) lithography system includes a source module generating light, a field facet mirror including first mirrors that collect the light transmitted from the source module, a pupil facet mirror including second mirrors that transmit the light transmitted from the field facet mirror to a reticle, a projection optical system transmitting the light reflected from the reticle to a substrate, a sensor module disposed on a substrate stage that supports the substrate and generating a first image representing a light intensity distribution, and a processor performing a Fourier transformation on the first image to generate a second image representing a first pupil region defined by a first center point and a plurality of second center points each spaced apart from the first center point by a first distance. The first center point is located at a center of the first pupil region.