EUV Lithography Source Vane Heating for Byproduct Removal
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Solution Overview
Problem
The manufacturing of semiconductor devices with increasingly smaller dimensions faces challenges due to the limitations of traditional optical masks and photolithography equipment, as the spacing between elements is less than the pitch that can be manufactured, approaching the theoretical limits of photolithography equipment.
Innovation Solution
A cleaning process is performed to clean plasma generation byproducts from vanes of a lithography system by pre-heating the lower portions of the vanes to reduce the temperature difference between upper and lower portions, uniformly heating them to melt the byproducts, and evacuate them to prevent re-solidification and damage to components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional optical masks and photolithography equipment are used, then manufacturing process is simple, but manufacturing precision deteriorates when pitch is below theoretical limits
Solution Approach 1:
The patent changes the wavelength parameter of light from traditional optical ranges to extreme ultraviolet (EUV) range (10-100 nm), enabling manufacturing of features below the theoretical diffraction limit of conventional photolithography. This parameter change allows achieving smaller pitch values while maintaining manufacturing feasibility
Solution Approach 2:
The patent replaces traditional mechanical photolithography equipment with a plasma-based EUV generation system. Instead of using mechanical lenses and masks that are limited by diffraction, the invention uses plasma generation in a controlled environment to create EUV light, substituting mechanical optical systems with a plasma-physics-based approach
2Reliability
If plasma generation byproducts are not cleaned from vanes, then maintenance time is reduced, but reliability deteriorates due to re-solidification damage
Solution Approach 1:
The patent applies preliminary heating to the vanes before the main heating cycle. By pre-heating the vanes to a lower temperature first, the system prepares the surface for subsequent byproduct removal while minimizing thermal shock and preventing premature re-solidification of byproducts during the cleaning process
Solution Approach 2:
The patent implements a periodic cleaning cycle with distinct phases: preliminary heating phase, main heating phase for byproduct removal, and cooling phase. This periodic action with controlled temperature cycles enables effective byproduct removal while preventing re-solidification damage and extending EUV source lifespan
3Ease of manufacture
If uniform heating is applied to vanes, then byproducts melt effectively, but temperature difference control becomes difficult
Solution Approach 1:
The patent divides the heating process into segmented temperature zones and time phases. The preliminary heating phase targets specific regions of the vanes at lower temperatures, while the main heating phase applies higher temperatures for byproduct melting. This segmentation of the heating process enables controlled temperature distribution that effectively removes byproducts while managing thermal gradients
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process reduces the risk of byproduct re-solidification, thereby increasing the lifespan of the EUV source and maintaining system efficiency, with improved availability and reduced maintenance time.
Implementation Method 1
A heating element may be positioned on or near the lower portion of the vane to provide supplemental heating
Implementation Method 2
uniformly heating them to melt the byproducts
Data Source
AI summary
In an embodiment, a method includes: heating a byproduct transport ring of an extreme ultraviolet source, the byproduct transport ring disposed beneath vanes of the extreme ultraviolet source; after heating the byproduct transport ring for a first duration, heating the vanes; after heating the vanes, cooling the vanes; and after cooling the vanes for a second duration, cooling the byproduct transport ring.