EUV Substrate Stage Wireless Control and Magnetic Shielding

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Solution Overview

Problem

Existing semiconductor substrate stages in EUV lithography systems suffer from reduced yield due to particle generation from cable friction during the lithography process, necessitating a reduction in the number of cables used for signal transmission.

Innovation Solution

Implementing a wireless communication system for control signals to the substrate stage, combined with a magnetic shielding layer to prevent magnetic interference, thereby reducing particle generation and increasing yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If cables are used for signal transmission to the substrate stage, then signal transmission is achieved, but particle generation occurs due to cable friction reducing yield

Engineering Contradiction:
ImproveyieldVSAvoidparticle generation
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent removes cables from the substrate stage system entirely, extracting the harmful element that causes particle generation. Wireless communication technology is implemented to transmit control signals without physical cable connections, thereby eliminating the friction-induced particle generation while maintaining signal transmission functionality.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the mechanical cable connection system with a wireless communication system. Instead of using physical cables that generate particles through friction, electromagnetic waves are used to transmit control signals to the substrate stage, substituting a mechanical system with a field-based system that eliminates the harmful friction effect.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If wireless communication is implemented for control signals, then particle generation is reduced, but magnetic interference must be shielded against

Engineering Contradiction:
ImproveyieldVSAvoidmagnetic interference
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a magnetic shielding layer as an intermediary element between the wireless communication components and the external magnetic environment. This shielding layer acts as a mediator that blocks or attenuates magnetic interference from reaching the wireless communication system, protecting it from harmful magnetic effects while allowing the wireless signal transmission to function.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The magnetic shielding layer is implemented in advance to prevent magnetic interference before it can affect the wireless communication system. By placing the shielding layer around the wireless communication components, the system proactively counteracts potential magnetic interference, ensuring reliable signal reception without the need for corrective measures after interference occurs.

Inventive Principle:
Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The wireless communication system reduces particle generation, enhancing the yield and accuracy of the lithography process by minimizing cable-related interference, while the magnetic shielding layer ensures reliable signal reception.

Implementation Method 1

a magnetic shielding layer to prevent magnetic interference

Methodology Applied
Scientific EffectMagnetic shielding: Magnetic Field

Data Source

PatentUS20240377762A1Semiconductor substrate stage for carring substrate
Publication Date: 2024.11.14 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20240377762A1 patent drawing
  • US20240377762A1 patent drawing
  • US20240377762A1 patent drawing

AI summary

A semiconductor substrate stage for carrying a substrate is provided. The semiconductor substrate stage includes a carrier layer, a storage layer having an energy storage device and a water storage device, a magnetic shielding layer disposed between the carrier layer and the storage layer, and a receiver disposed in a recess of the carrier layer and partially exposed from the carrier layer.