EUV Target Nozzle Oxidation Control via Hydrogen Atmosphere
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Solution Overview
Problem
In EUV light generation systems, the oxidation of target materials like tin at the nozzle surface leads to the formation of tin oxide films, causing clogging and trajectory deviations of the target droplets, which hampers stable operation and efficiency.
Innovation Solution
A chamber device with a target generation system that includes a hydrogen gas supply to reduce oxygen partial pressure by reacting with moisture, using a moisture remover to maintain a low oxygen environment, and controlling temperature to prevent oxidation, ensuring stable target material discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the target material is supplied at room temperature, then the target material remains in solid state and easy to handle, but the nozzle hole becomes clogged by oxidized target material
Solution Approach 1:
The patent changes the temperature parameter of the target material from room temperature to a heated state (above melting point), transforming it from solid to liquid state to prevent oxidation and clogging while maintaining ease of operation through automated temperature control
Solution Approach 2:
The patent introduces a gas supply mechanism that provides an inert or reducing atmosphere around the nozzle section, preventing oxidation of the molten target material and eliminating the formation of oxidized clogs in the nozzle hole
2Productivity
If the target material is heated to melt it for discharge, then the target material can be discharged smoothly, but oxidation of the target material occurs
Solution Approach 1:
The patent applies a gas supply mechanism that creates an inert or reducing atmosphere around the heated target material and nozzle section, preventing oxidation while maintaining the heated state necessary for smooth discharge
Solution Approach 2:
The patent controls the temperature parameter to maintain the target material in a molten state above its melting point, enabling smooth discharge while combining this with atmospheric control to prevent oxidation
3Object-affected harmful factors
If hydrogen gas is supplied to reduce oxygen partial pressure, then oxidation is suppressed, but moisture generation occurs from hydrogen reaction with oxygen
Solution Approach 1:
The patent converts the potentially harmful moisture generation from hydrogen-oxygen reaction into a beneficial process by using the hydrogen atmosphere to reduce oxygen partial pressure and suppress oxidation, while managing moisture through the heated environment that prevents condensation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses oxidation of the target material, maintaining a stable and efficient EUV light generation process by preventing tin oxide film formation and ensuring consistent target trajectory.
Implementation Method 1
a gas supply source configured to supply gas containing hydrogen to the gas nozzle such that the gas containing the hydrogen is supplied to at least periphery of the nozzle section
Implementation Method 2
a moisture remover configured to remove moisture at least in the periphery of the nozzle section in the chamber
Implementation Method 3
The temperature variable device may be configured to raise the temperature of the target material in the tank to allow the target material to melt
Data Source
AI summary
A chamber device may include a chamber, and a target generation device assembled into the chamber and configured to supply a target material into the chamber, the target generation device including a tank configured to store the target material, a temperature variable device configured to vary temperature of the target material in the tank, and a nozzle section in which a nozzle hole configured to output the target material in a liquid form is formed, and the chamber device may further include a gas nozzle having an inlet port facing the nozzle section and configured to introduce gas into the chamber, a gas supply source configured to supply gas containing hydrogen to the gas nozzle to supply the gas containing the hydrogen to at least periphery of the nozzle section, and a moisture remover configured to remove moisture at least in the periphery of the nozzle section in the chamber.


