EUV Wafer Chuck Cleaning with a Bi-Polar Spinning Electrode
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Solution Overview
Problem
The use of electrostatic chucks in semiconductor manufacturing leads to particle contamination on the substrate chuck surface, causing heat transfer gas leakage and reducing temperature control and substrate cooling efficiency, necessitating frequent and time-consuming manual cleaning, resulting in apparatus down-time.
Innovation Solution
A bi-polar spinning electrode is used to generate a symmetric electric field that attracts and adsorbs both positively and negatively charged debris particles from the electrostatic chuck surface, complementing existing stone cleaning methods to effectively remove residual contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual cleaning operation is used to remove particles from substrate chuck surface, then cleaning effectiveness is improved, but apparatus down-time increases and productivity decreases
Solution Approach 1:
The system performs automatic cleaning of the substrate chuck surface without requiring manual intervention. The cleaning apparatus includes a cleaning head with abrasive elements that automatically remove particles from the chuck surface during or between processing cycles, eliminating the need for manual cleaning operations and continuous apparatus shutdown.
Solution Approach 2:
The patent replaces manual mechanical cleaning operations with an automated cleaning system. The cleaning apparatus uses mechanical abrasion through rotating or oscillating cleaning heads with abrasive materials to remove particles from the substrate chuck surface, substituting human labor with automated mechanical cleaning mechanisms.
2Temperature
If frequent cleaning operation is performed to maintain temperature control, then substrate cooling efficiency is improved, but apparatus down-time increases
Solution Approach 1:
The cleaning apparatus performs preliminary cleaning actions during or between processing cycles to prevent particle accumulation that would compromise temperature control. By maintaining continuous or near-continuous cleanliness of the substrate chuck surface, the system avoids the need for frequent interruptions for cleaning operations.
Solution Approach 2:
The cleaning system operates continuously or periodically to maintain constant cleanliness of the substrate chuck surface, ensuring uninterrupted temperature control and cooling efficiency. The cleaning action is integrated into the processing cycle, eliminating idle down-time periods.
3Object-generated harmful factors
If electrostatic chuck is used to hold substrate, then mechanical clamp rings are eliminated and particle formation is reduced, but small debris particles are still formed over time
Solution Approach 1:
The cleaning apparatus extracts and removes small debris particles from the substrate chuck surface that accumulate over time during electrostatic chuck operation. The cleaning head with abrasive elements selectively removes these particles while preserving the electrostatic chuck surface integrity, separating the contamination removal function from the substrate holding function.
Solution Approach 2:
The cleaning apparatus acts as an intermediary system that addresses particle contamination issues without interfering with the electrostatic chuck's substrate holding capability. The cleaning mechanism is designed to remove particles while maintaining the electrostatic field integrity and chuck surface properties, serving as a separate function that complements the electrostatic holding function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The bi-polar spinning electrode enhances cleaning efficiency by removing smaller particles that settle between burls on the electrostatic chuck, improving manufacturing performance and reducing down-time by automating the cleaning process.
Implementation Method 1
A bi-polar spinning electrode is used to generate a symmetric electric field that attracts and adsorbs both positively and negatively charged debris particles from the electrostatic chuck surface
Implementation Method 2
attracts and adsorbs both positively and negatively charged debris particles from the electrostatic chuck surface
Data Source
AI summary
Cleaning equipment for an EUV wafer chuck or clamp, which removes particles that have accumulated between burls on the surface of the wafer chuck. The equipment includes a spinning bi-polar electrode placed in proximity to the surface, which can attract and adsorb the charged particle residue therefrom using its generated symmetric electric field when the wafer chuck is not in use.