EV Busbar Injection Molding for Short Circuit Prevention

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Solution Overview

Problem

Conventional bus bars for electric vehicles, manufactured using integrated body and sensing parts, face issues such as short circuits due to relaxation and contraction, increased manufacturing costs, and difficulty in confirming bonding quality, especially when using heterogeneous materials and processes like ultrasonic or laser bonding.

Innovation Solution

A method involving primary and secondary insert injection molding to position the body and sensing parts within an injection-molded product, enhancing the bus bar's durability by forming an enhanced part using an injection material that improves strength and insulation at fatigue-prone areas, and providing elasticity through a connection part with a curved design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the body part and sensing part are manufactured separately and bonded together, then the manufacturing process is more flexible, but the durability of the bonded part degrades and manufacturing cost increases

Engineering Contradiction:
Improvemanufacturing process flexibilityVSAvoiddurability of bonded part
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent merges the body part and sensing part into a single integrated structure manufactured through injection molding. This eliminates the need for separate bonding processes, thereby preventing durability degradation at bonded interfaces while reducing manufacturing complexity and cost.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The injection-molded bus bar structure serves multiple functions simultaneously: it provides both the body part and sensing part in a single component, eliminates bonding requirements, and integrates structural support with electrical sensing functions, thereby improving reliability without sacrificing manufacturing flexibility.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Device complexity

If the body part and sensing part are integrated into a single structure, then the bonding process is eliminated, but relaxation and contraction cause short circuits between the sensing part and body part

Engineering Contradiction:
Improvemanufacturing process complexityVSAvoidelectrical insulation between parts
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent applies local quality by incorporating an enhanced part with different material properties at specific locations within the integrated bus bar structure. This enhanced part provides localized insulation and mechanical stability at critical areas prone to relaxation and contraction, preventing short circuits while maintaining the overall integrated structure.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent uses composite materials by combining the base injection-molded material with an enhanced part material that has superior insulation and mechanical properties. This composite structure addresses the relaxation and contraction issues in critical areas while maintaining the benefits of integrated manufacturing.

Inventive Principle:
Principle #40Composite materials

3Strength

If heterogeneous materials are used for body part and sensing part, then material properties can be optimized, but confirming bonding quality becomes difficult and quality problems increase

Engineering Contradiction:
Improvematerial property optimizationVSAvoidbonding quality detection
Core Design Contradiction:
StrengthVSDifficulty of detecting and measuring

Solution Approach 1:

The patent merges the body part and sensing part into a single homogenous injection-molded structure, eliminating bonding interfaces. This resolves the quality detection problem by removing the need to inspect bonding quality, while still allowing material property optimization through the selection of appropriate injection molding materials and the addition of enhanced parts at critical locations.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11465320B2Method for manufacturing busbar and manufacturing busbar through the same
Publication Date: 2022.10.11 DAE SAN ELECTRONICS
  • US11465320B2 patent drawing
  • US11465320B2 patent drawing
  • US11465320B2 patent drawing

AI summary

According to an embodiment of the present disclosure, provided is a method for manufacturing a bus bar in which a frame including a sensing part and a body part connected to the sensing part is prepared, the frame is inserted into and fixed to an injection molding mold, and an enhanced part enhancing the strength at a position where fatigue is concentrated by an enhancing injection material injected into the injection molding mold is formed in the frame.