EV Control Unit Heat Dissipation via Partial Exposure
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Solution Overview
Problem
Conventional electric vehicle control units face difficulties in heat dissipation due to the presence of resin in internal spaces, which hinders effective thermal management of electronic components.
Innovation Solution
The electric vehicle incorporates a control unit design with a supporting structure that partially exposes electronic components, eliminating the need for resin fillers and incorporating a heat dissipation sheet between the case member and electronic components to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin is filled in the internal space between the upper case and the electronic component, then the electronic component is protected and positioned, but heat dissipation is hindered
Solution Approach 1:
The patent removes the resin filler from the internal space between the upper case and the electronic component. By extracting this heat-insulating material, the electronic component is partially exposed to the external environment, enabling direct heat dissipation to the outside air while maintaining protection through the supporting structure and case member design.
Solution Approach 2:
The case member is divided into a lower case and an upper case that can be assembled separately. The supporting structure is integrated into the upper case, creating a modular design that allows the electronic component to be positioned and protected while maintaining exposure for heat dissipation. This segmentation enables the protective function to be separated from the heat dissipation function.
2Stability of the object's composition
If resin is used to fill internal spaces, then components are fixed and protected, but thermal management capability deteriorates
Solution Approach 1:
The resin filler is completely removed from the internal space. This extraction eliminates the thermal barrier that prevented heat dissipation, while the protective and positioning functions are transferred to the supporting structure integrated into the upper case, which provides mechanical support without thermal insulation.
3Reliability
If electronic component is fully enclosed in the case, then protection is maximized, but heat dissipation is reduced
Solution Approach 1:
The electronic component is partially exposed rather than fully enclosed. The upper case provides protection for the control board and other components while leaving the electronic component partially exposed to enable heat dissipation. This partial exposure achieves the optimal balance between protection and thermal management.
Solution Approach 2:
Different parts of the case have different levels of enclosure. The lower case and parts of the upper case provide full enclosure for certain components, while the region around the electronic component is open or partially enclosed to allow heat dissipation. This local variation in enclosure quality optimizes both protection and thermal management for different components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient heat dissipation of electronic components without using resin, improving thermal management and positioning of components within the control unit.
Implementation Method 1
a heat dissipation sheet disposed between the case member and the electronic component
Data Source
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AI summary
An electric vehicle, which can suitably dissipate heat which is generated by an electronic component, is provided. A straddled vehicle 1 includes a vehicle body frame 2, an electric motor 7 and a control unit 8. The electric motor 7 is mounted to the vehicle body frame 2. The control unit 8 includes a case member 20, a control board 21, an electronic component 22 and a supporting structure 23. The case member 20 forms an internal space S. The control board 21 is mounted to the case member 20 in the internal space S. The electronic component 22 is mounted to the control board 21 in the internal space S. The supporting structure 23 is provided on an inner surface of the case member 20. The supporting structure 23 supports the electronic component 22 so that the electronic component 22 is partially exposed in the internal space S.