EV Inverter Module Segmentation for Thermal Density

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Solution Overview

Problem

Existing electric vehicle inverter modules face challenges in providing efficient and compact power solutions with high power density, low EMI noise, and ease of manufacturing, while maintaining compatibility for mass production.

Innovation Solution

A modular inverter module design comprising three power modules arranged in a triplet configuration, each including a capacitor, heat sink, ceramic plates, transistors, a laminated bus bar, and a gate drive printed circuit board, with a dielectric gel tray for insulation and thermal management, to provide three-phase power to electric vehicle drive systems.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If a compact inverter module design is implemented, then power density is improved, but thermal dissipation becomes more difficult

Engineering Contradiction:

Improvepower densityVSAvoidthermal dissipation

Core Design Contradiction:

Quantity of substanceVSTemperature

Solution Approach 1:

The inverter module is divided into three separate power modules (half-bridge modules) arranged in a triplet configuration. Each power module contains its own capacitor, heat sink, and transistor assembly. This segmentation allows for optimized thermal management of each module while maintaining high overall power density through compact integration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs a nested structure where ceramic plates are positioned between the heat sink and transistors, with the locator having slots that accommodate transistors. The laminated bus bar is disposed over the locator, and the gate drive PCB is coupled to the bus bar. This nested arrangement maximizes space utilization and thermal contact while maintaining electrical isolation.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Ease of manufacture

If manufacturing complexity is reduced, then ease of manufacture is improved, but manufacturing precision may deteriorate

Engineering Contradiction:

Improveease of manufactureVSAvoidmanufacturing precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The locator is designed with predetermined slots for positioning transistors, and the laminated bus bar is pre-configured with connection points. The gate drive PCB is pre-assembled with necessary circuitry before integration into the power module. These preliminary arrangements simplify the assembly process while ensuring precise component placement and electrical connections.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The modular design achieves high power density, reduces EMI noise, and simplifies manufacturing, enabling efficient thermal dissipation and insulation, thus addressing the challenges of existing inverter modules.

Implementation Method 1

a heat sink coupled with a first surface of the capacitor

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a dielectric gel tray disposed over a first surface of the gate drive printed circuit board

Methodology Applied

Scientific EffectDielectric insulation: Dielectric

Data Source

PatentUS10778117B2Inverter module of an electric vehicle

Publication Date: 2020.09.15 CHONGQING JINKANG POWERTRAIN NEW ENERGY CO LTD

AI summary

Provided herein is an inverter module to power an electric vehicle. The inverter module can include a power module or multiple power modules. The power module can include a capacitor and a heat sink coupled with the capacitor. The power module can include a ceramic plate coupled with the heat sink. The power module can include a locator having a plurality of slots and a plurality of transistors disposed within the plurality of slots. The locator and the plurality of transistors can be disposed over a first surface of the ceramic plate. The power module can include a laminated bus bar disposed over a first surface of the locator. The power module can include a gate drive printed circuit board coupled with the laminated bus bar. The power module can include a dielectric gel tray disposed over a first surface of the gate drive printed circuit board.