Offset-Substrate EV Inverter Power Module for Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Inverters for electric vehicles face challenges with thermal management due to heat generation by power modules, which can lead to incorrect operation and overheating, compromising the inverter's performance.
Innovation Solution
A power module design incorporating a first and second substrate with an electrically conductive spacer and a flex circuit to manage thermal characteristics, using materials like silicon nitride and metal for improved heat dissipation and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power module devices are used to generate high power, then power output is improved, but heat generation increases causing thermal management issues
Solution Approach 1:
The power module is divided into multiple semiconductor dies (e.g., IGBTs and diodes) mounted on separate substrates, allowing heat to be distributed across multiple heat dissipation paths rather than concentrated in a single location, thus managing thermal load effectively while maintaining high power output
Solution Approach 2:
Electrically conductive spacers are introduced as intermediary components between substrates to provide both electrical connection and thermal management. These spacers facilitate heat transfer between substrates while maintaining electrical connectivity, resolving the conflict between power generation and heat dissipation
2Volume of moving object
If substrates are placed close together to reduce module size, then compactness is improved, but thermal management becomes difficult
Solution Approach 1:
The design utilizes three-dimensional stacking of substrates with electrically conductive spacers providing thermal and electrical pathways in the vertical dimension. This allows compact horizontal footprint while maintaining effective thermal management through vertical heat dissipation paths via the spacers
3Reliability
If electrically conductive spacers are used to connect substrates, then electrical connectivity is improved, but manufacturing complexity increases
Solution Approach 1:
The electrically conductive spacers serve multiple functions simultaneously: they provide electrical connection between substrates, facilitate thermal management through heat conduction, and maintain mechanical spacing. This multi-functionality reduces the need for separate components, ultimately simplifying the overall manufacturing process despite the specialized nature of the spacers
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal management and electrical connectivity, preventing overheating and ensuring reliable operation of the inverter.
Implementation Method 1
an electrically conductive spacer connecting the first substrate to the second substrate
Implementation Method 2
the middle section includes a ceramic, and the outer surface and the inner surface of the first substrate includes a metal
Data Source
AI summary
A power module includes: a first substrate having an outer surface and an inner surface, the first substrate extending from a first longitudinal end toward a second longitudinal end; a semiconductor die coupled to the inner surface of the first substrate; and a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate, the second substrate extending from a first longitudinal end toward a second longitudinal end, wherein the first longitudinal end of the first substrate is longitudinally offset from the first longitudinal end of the second substrate.