Stacked PCB Power Converter Housing for EV Isolation and Strength

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Solution Overview

Problem

The increasing volume and components of vehicle-mounted power supply apparatuses in electric vehicles affect the layout and structural strength, particularly due to the expansion of power conversion circuits, which is exacerbated by the need for low-voltage supply power for autonomous driving and various electrical equipment.

Innovation Solution

A vehicle-mounted power supply apparatus with a stacked design of a power conversion circuit, including an upper-layer PCB, lower-layer PCB, and heat sink, fastened to a bottom housing, which reduces internal volume, enhances structural stability, and allows for flexible electrical port arrangements and component distribution, optimizing layout and miniaturization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If the power conversion circuit components are increased to meet increasing low-voltage supply power requirements, then the power supply capability is improved, but the volume of the vehicle-mounted power supply apparatus increases rapidly

Engineering Contradiction:
Improvepower supply capabilityVSAvoidvolume of power supply apparatus
Core Design Contradiction:
PowerVSVolume of stationary object

Solution Approach 1:

The patent transitions from a planar layout to a three-dimensional stacked architecture, arranging the bottom housing, lower-layer PCB, upper-layer PCB, and heat sink in vertical layers. This dimensional change allows multiple components to occupy overlapping footprints in different height levels, significantly increasing power supply capability without proportionally increasing the apparatus volume.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a nested arrangement where the lower-layer PCB is positioned within the bottom housing, the upper-layer PCB is stacked above the lower-layer PCB, and the heat sink is integrated above the upper-layer PCB. This nesting approach allows components to be space-efficiently arranged in vertical succession, maximizing power density while minimizing overall volume.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Adaptability or versatility

If more components are added to the power conversion circuit, then the power conversion function is improved, but the mounting structural strength deteriorates

Engineering Contradiction:
Improvepower conversion functionVSAvoidmounting structural strength
Core Design Contradiction:
Adaptability or versatilityVSStrength

Solution Approach 1:

The patent divides the power conversion circuit into separate functional modules distributed across different PCB layers and the bottom housing. The lower-layer PCB handles AC-to-DC conversion, the upper-layer PCB handles DC-to-DC conversion, and the bottom housing provides structural support and additional mounting. This segmentation allows each component to be optimally designed for its specific function while maintaining overall structural integrity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent combines the structural housing with the mounting function, integrating the bottom housing as both a protective enclosure and a mounting platform for the lower-layer PCB and other components. This merging of structural and functional roles strengthens the overall mounting structure while accommodating increased component density.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a compact, stable, and efficient power supply apparatus that meets diverse power consumption needs, enhances electrical isolation, and improves space utilization while maintaining structural integrity and cooling efficiency.

Implementation Method 1

the heat sink can cool and dissipate heat for a heat emitting component on the upper-layer PCB

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the heat sink can cool and dissipate heat for a heat emitting component on the upper-layer PCB

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentEP4672892A2Vehicle-mounted power supply apparatus and vehicle
Publication Date: 2025.12.31 HUAWEI DIGITAL POWER TECH CO LTD
  • EP4672892A2 patent drawingFigure 1~2
  • EP4672892A2 patent drawingFigure 3
  • EP4672892A2 patent drawingFigure 4~5

AI summary

This application provides a vehicle-mounted power supply apparatus and a vehicle. The vehicle-mounted power supply apparatus includes a power conversion circuit, and an upper-layer PCB, a lower-layer PCB, and a heat sink that are stacked in and fastened to a bottom housing. The heat sink, the upper-layer PCB, and the lower-layer PCB are stacked, so that internal space occupied in the vehicle-mounted power supply apparatus can be reduced. In addition, these components are fastened to the bottom housing, so that structural strength of the vehicle-mounted power supply apparatus is strong. The power conversion circuit receives external power supply through a power port, outputs a first direct current through a first direct current port, and outputs a second direct current through a second direct current port. The lower-layer PCB is electrically connected to the first direct current port, and the upper-layer PCB is electrically connected to the second direct current port and the power port. The upper-layer PCB and the lower-layer PCB that are stacked are electrically connected to different ports separately. Compared with a solution in which the different ports are electrically connected to one PCB, electrical port arrangement is more flexible, so that safety of electrical isolation of the vehicle-mounted power supply apparatus is higher.