EV Power Module Substrate Layout for Lower Thermal Resistance
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Solution Overview
Problem
Existing power modules in electric vehicles face high thermal resistances due to the use of discrete semiconductor packages with nonconductive rear surfaces, requiring additional thermal interface materials and limiting thermal conductance, which can lead to overheating and performance issues.
Innovation Solution
A power module design featuring an insulating substrate with conductive nanowires formed on both sides, eliminating the need for thermal interface materials by reducing the distance between semiconductor switches and the heatsink, thereby enhancing heat dissipation through direct thermal coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete semiconductor packages with nonconductive rear surfaces are used, then electrical insulation is achieved, but thermal resistance increases significantly
Solution Approach 1:
The patent merges the electrical insulation function and thermal conduction function into a single integrated substrate structure. The insulating substrate incorporates conductive pathways that allow heat to flow from the semiconductor devices to the heatsink while maintaining electrical isolation, eliminating the need for separate thermal interface materials.
Solution Approach 2:
The insulating substrate acts as an intermediary element between the semiconductor devices and the heatsink. It provides the dual function of electrical insulation and thermal conduction, mediating the thermal and electrical interactions while reducing overall thermal resistance compared to using separate insulation layers and thermal interface materials.
2Reliability
If additional thermal interface materials are used for electrical insulation, then electrical isolation is provided, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent combines multiple functions (electrical insulation, thermal conduction, and structural support) into a single insulating substrate component. This integration eliminates the need for separate thermal interface materials and reduces the total number of components that need to be assembled and managed in the power module.
Solution Approach 2:
The insulating substrate is designed as a multi-functional component that simultaneously provides electrical insulation, thermal conduction pathways, and mechanical support for the semiconductor devices. This universal component replaces what would traditionally require multiple specialized components.
3Reliability
If thermal interface materials are used, then electrical insulation is achieved, but production time and manufacturing complexity increase
Solution Approach 1:
The electrical insulation and thermal conduction pathways are pre-integrated into the insulating substrate during its manufacturing process, before the power module assembly begins. This preliminary integration eliminates the need for additional assembly steps during module production, as the substrate is already configured to provide both insulation and thermal management functionality.
Solution Approach 2:
By combining the insulation and thermal interface functions into a single pre-manufactured substrate component, the patent reduces the number of assembly operations required during power module production, thereby improving manufacturing efficiency and reducing production time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces thermal resistance and improves heat discharge and cooling efficiency in power modules, preventing overheating and enhancing the performance of electric drive systems in vehicles.
Implementation Method 1
A heatsink is used in the power module for this, which is coupled thermally to the power switch
Implementation Method 2
Numerous contact wires are formed, which are located on the first side and second side of the insulating substrate. The contact wires are made of an electrically conductive material
Data Source
AI summary
The invention relates to a method for producing a power module, comprising: providing an insulating substrate, composed of a first metal layer, a second metal layer, and an insulating layer placed between the first metal layer and second metal layer; formation of numerous contact wires located on a first side of the insulating substrate facing away from the second metal layer and on a second side of the insulating substrate facing away from the first metal layer; applying an electrically conductive layer to the first side, which comes in contact with numerous power switches, and applying a heatsink to the second side.