Evacuated Indium Thermal Interface for Multi-Core Heat Dissipation
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Solution Overview
Problem
Traditional thermal interface materials fail to provide adequate heat transfer for multi-core processors due to limitations in air cooling and susceptibility of indium to corrosion and oxidation, which compromises thermal conductivity.
Innovation Solution
A sealed and evacuated metallic thermal interface using indium, secured within a modified threaded heat sink, forms a covalent bond with the heat sink surface, preventing corrosion and oxidation by removing air from the interface, thereby maintaining effective thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If indium is used as a thermal interface material, then thermal conductivity is improved, but corrosion and oxidation occur compromising thermal conductivity
Solution Approach 1:
The patent applies the inert atmosphere principle by evacuating the interface between the indium thermal interface material and the heat sink to remove oxygen and moisture. This creates a vacuum environment that prevents oxidation of the indium, thereby maintaining its thermal conductivity and corrosion resistance over time while preserving the high thermal transfer capability.
2Device complexity
If air cooling is used, then device complexity is reduced, but heat dissipation capability is insufficient for multi-core processors
Solution Approach 1:
The patent applies parameter changes by transitioning from air cooling to direct metallic thermal contact with indium. This changes the thermal conductivity parameter of the interface from the low conductivity of air to the high conductivity of indium metal, enabling effective heat dissipation for multi-core processors while maintaining relatively simple heat sink structures.
3Ease of manufacture
If traditional thermal interface materials are used, then ease of manufacture is improved, but heat transfer capability is insufficient for high-performance processors
Solution Approach 1:
The patent applies composite materials by combining indium metal with the heat sink structure. The indium layer is applied to the heat sink surface and then evacuated to form a composite thermal interface that achieves superior heat transfer capability compared to traditional thermal interface materials, while the manufacturing process remains relatively simple involving material application and vacuum evacuation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures reliable and enhanced heat transfer between multi-chip modules and heat sinks, maintaining microprocessor temperature within specifications, even in high-power environments, by preventing corrosion and oxidation of indium.
Implementation Method 1
an indium thermal interface material which is contained within a module-heat sink interface which is evacuated and sealed
Implementation Method 2
indium as a metallic thermal interface for enhanced heat transfer between a multi chip module... and a heat sink
Data Source
AI summary
An apparatus and method for creating a metallic thermal interface is shown for connecting an electronic module to a heat sink. Using an interface metal such as indium or malleable indium alloys, which have superior heat transfer capability, but are subject to oxidization and degraded thermal transfer capability; a layer of interface material is confined in a recess in the heat sink base into which the module cap is received. The thermal interface region is then evacuated to bring the module top surface and recess major surface into intimate contact and sealed along the interface of the module and recess side walls to exclude air from the metallic interface region.