Evaporation Chamber Temperature Control via Pressure Adjustment
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in reducing installation space and simplifying configuration due to high heat input from plasma, which requires extensive cooling medium circulation and complex setups, especially when latent heat of evaporation is used.
Innovation Solution
A substrate processing apparatus with a temperature adjustment unit that forms a wet surface with a cooling medium on a component member's rear surface, isolates it in an evaporation chamber, and adjusts pressure to control temperature through latent heat of evaporation, eliminating the need for extensive cooling medium circulation and complex configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling medium circulation system is used to adjust temperature, then temperature control capability is improved, but installation space increases and configuration becomes complex
Solution Approach 1:
The patent utilizes the phase transition (evaporation) of a cooling medium to achieve temperature control. By allowing the cooling medium to evaporate on the rear surface of the susceptor, latent heat of evaporation is absorbed, effectively removing heat from the substrate processing area. This eliminates the need for complex circulation systems with pumps, heat exchangers, and expansion devices, thereby simplifying the configuration while maintaining effective temperature control capability.
2Temperature
If cooling performance is increased to handle high plasma heat input, then temperature control effectiveness is improved, but installation space increases
Solution Approach 1:
The invention exploits the latent heat of evaporation of the cooling medium to achieve high cooling effectiveness in a compact form. When the cooling medium evaporates on the susceptor rear surface, it absorbs a large amount of heat without requiring extensive circulation infrastructure. This phase transition mechanism provides superior cooling performance per unit space compared to conventional circulation systems, thereby improving temperature control effectiveness while reducing installation space.
3Productivity
If a latent heat evaporation cooling system is implemented, then cooling efficiency is improved, but apparatus configuration becomes complex
Solution Approach 1:
The patent implements a simplified latent heat evaporation cooling system where the cooling medium is supplied to the rear surface of the susceptor and allowed to evaporate directly. This approach achieves high cooling efficiency by utilizing the large latent heat of vaporization, while avoiding the complex configuration of traditional vapor compression systems. The simplified setup requires only supply pathways for the cooling medium, eliminating the need for compressors, condensers, expansion valves, and associated circulation piping.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces installation space and simplifies the apparatus configuration by effectively controlling the temperature of the component member using latent heat of evaporation, allowing for efficient temperature adjustment without the need for extensive cooling medium circulation or complex setups.
Implementation Method 1
the pressure in the evaporation chamber is adjusted by using the pressure adjustment device such that the cooling medium which forms the wet surface is evaporated, thereby controlling a temperature of the temperature adjustment surface due to latent heat of evaporation of the cooling medium
Data Source
AI summary
A temperature adjustment method comprising: forming a wet surface wet with a cooling medium by supplying the cooling medium to a rear surface of a temperature adjustment surface of a component member in a processing chamber of a substrate processing device comprising the processing chamber which performs predetermined processing on a substrate and is vacuum-exhaustible; and adjusting a temperature of the temperature adjustment surface due to latent heat of evaporation of the cooling medium by evaporating the cooling medium which forms the wet surface by adjusting a pressure in an evaporation chamber which isolates the wet surface from an atmosphere around the wet surface.