Evaporation Apparatus Heat Shield for Anode Film Quality
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The vacuum evaporation method for forming anode active materials on current collectors faces challenges with excessive temperature rise due to radiation heat from the evaporation source, leading to potential melting of the current collector and unwanted intermetallic compound formation, which affects the quality and efficiency of the anode production.
Innovation Solution
An evaporation apparatus is designed with a heat shield member positioned closer to the evaporation source than the current collector, which blocks part of the radiation heat, preventing excessive temperature rise and reducing unwanted reactions, thereby improving the quality and efficiency of the anode active material deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the evaporation source temperature is increased to improve production efficiency, then the vaporization rate increases, but the current collector temperature rises excessively causing melting or intermetallic compound formation
Solution Approach 1:
A heat shield member is introduced as an intermediary component between the evaporation source and the current collector. This heat shield blocks and reflects radiation heat from reaching the current collector, allowing the evaporation source to operate at high temperature for high vaporization rate while protecting the current collector from excessive temperature rise that would cause melting or intermetallic compound formation.
2Productivity
If the evaporation source temperature is increased to deposit more material in shorter time, then production efficiency improves, but the quality of thin film deteriorates due to unwanted reactions
Solution Approach 1:
The heat shield member serves as a protective intermediary that allows aggressive evaporation conditions (high temperature, high deposition speed) to be maintained while preventing harmful thermal effects on the current collector. By blocking radiation heat, the heat shield prevents unwanted intermetallic compound formation and material melting, thereby maintaining thin film quality even at high deposition speeds.
Solution Approach 2:
The heat shield member is positioned in advance between the evaporation source and current collector to preemptively block radiation heat before it can reach the current collector. This preliminary protective action prevents the occurrence of harmful effects such as intermetallic compound formation and material melting, allowing high-temperature evaporation to proceed without compromising film quality.
3Device complexity
If radiation heat is allowed to reach the current collector, then the evaporation process is simpler, but harmful effects occur including melting and intermetallic compound generation
Solution Approach 1:
A heat shield member is introduced as a protective intermediary component between the evaporation source and the current collector. This heat shield blocks and reflects radiation heat, preventing harmful thermal effects such as melting and intermetallic compound formation on the current collector, while allowing the evaporation process to continue with relatively simple structural modifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of a heat shield member effectively inhibits radiation heat from reaching the current collector, maintaining the quality of the thin film formed and increasing the vaporization rate, thus enhancing production efficiency and cycle characteristics of the anode.
Implementation Method 1
a heat shield member that is located between the evaporation source and the evaporation object retained by the retention member, has an opening for passing the evaporation material in a state of vapor phase from the evaporation source to the evaporation object, and shields the evaporation object from part of radiation heat of the evaporation source
Implementation Method 2
Physical Vapor Deposition (PVD) method such as vacuum evaporation method in which a target (evaporation source) is heated, volatilized, and evaporated
Implementation Method 3
an evaporation apparatus for evaporating an evaporation material sublimated from an evaporation source to an evaporation object
Data Source
AI summary
An evaporation apparatus that is capable of stably forming a good quality thin film and is highly suitable for mass production is provided. The evaporation apparatus include an evaporation source discharging an evaporation material by heating, a retention member retaining an evaporation object, and a heat shield member that is located between the evaporation source and the evaporation object retained by the retention member, has an opening for passing the evaporation material in a state of vapor phase from the evaporation source to the evaporation object, and shields the evaporation object from part of radiation heat of the evaporation source. The heat shield member is located closer to the evaporation source than to the retention member.