Evaporation Source Baffle and Cooling Gas for Thin Film Uniformity

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Solution Overview

Problem

Existing evaporation sources for thin film deposition often result in non-uniform film thickness due to particle coalescence and excessive heat radiation, requiring large processing chambers that can deform substrates and necessitate oversized equipment.

Innovation Solution

An evaporation source with a baffle-equipped crucible and a shower head nozzle structure that minimizes particle coalescence and distributes heat effectively, combined with a movable design to reduce processing chamber size and substrate deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If conventional spray nozzle is used to apply evaporated deposition material, then deposition material can be applied onto substrate, but excess heat is radiated into processing chamber causing substrate deformation

Engineering Contradiction:
Improvedeposition material applicationVSAvoidsubstrate deformation due to heat radiation
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a cooling gas flow as an intermediary medium between the spray nozzle and substrate. This cooling gas absorbs excess heat from the evaporated deposition material before it reaches the substrate, preventing thermal deformation while enabling continuous deposition material application.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the temperature parameter of the deposition material by introducing cooling gas. The cooling gas reduces the temperature of evaporated particles from high-temperature state to a controlled temperature range, eliminating harmful thermal effects on the substrate while maintaining deposition functionality.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If evaporation source uses conventional heating method, then deposition material can be evaporated, but particles coalesce and form clusters resulting in non-uniform film thickness

Engineering Contradiction:
Improvedeposition material evaporationVSAvoidfilm thickness uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The cooling gas acts as an intermediary that interferes with particle coalescence. By introducing this gas medium, the patent prevents direct contact and aggregation of evaporated particles, maintaining their dispersion and enabling uniform film formation.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs periodic or continuous cooling gas flow to intermittently cool and disperse evaporated particles. This periodic action prevents continuous coalescence by repeatedly disrupting particle aggregation, resulting in uniform deposition.

Inventive Principle:
Principle #19Periodic action

3Adaptability or versatility

If large processing chamber is used to accommodate substrate movement, then rotatable substrate can be processed, but chamber size increases and equipment becomes oversized

Engineering Contradiction:
Improvesubstrate movement capabilityVSAvoidprocessing chamber size
Core Design Contradiction:
Adaptability or versatilityVSVolume of stationary object

Solution Approach 1:

Instead of moving the substrate through a large chamber, the patent inverts the approach by moving the evaporation source relative to a stationary substrate. This inversion eliminates the need for large chamber space while maintaining processing capability.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent introduces dynamic movement of the evaporation source rather than requiring substrate rotation. The movable evaporation source can dynamically adjust its position and trajectory, providing versatility without requiring large chamber volume for substrate movement mechanisms.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves uniform thin film deposition with reduced heat transfer, enabling smaller processing chambers and stable substrate handling, ensuring consistent film thickness and reduced substrate deformation.

Implementation Method 1

a heating unit to heat the crucible and evaporate the deposition material

Methodology Applied
Scientific EffectEvaporation: Evaporation

Implementation Method 2

introduction of a cooling gas flow into the processing chamber during the application of the evaporated deposition material onto the substrate

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentEP1803836B1Evaporation source and method of depositing thin film using the same
Publication Date: 2018.04.25 SAMSUNG DISPLAY CO LTD
  • EP1803836B1 patent drawingFigure 1
  • EP1803836B1 patent drawingFigure 2A~2B
  • EP1803836B1 patent drawingFigure 3A~3B

AI summary

An evaporation source for depositing a thin film includes a crucible having a space for a deposition material and at least one baffle, the baffle being positioned inside the crucible and to divide the crucible into a plurality of channels.