Evaporative Cooler Plate Layout for Low Thermal Isolation
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Solution Overview
Problem
Conventional evaporative cooling devices face challenges in achieving efficient heat transfer between primary and secondary air streams due to thermal isolation caused by hydrophilic layers and adhesive components, which reduce the heat conduction coefficient and increase pressure drop, limiting cooling efficiency to dew point temperatures.
Innovation Solution
The use of spaced, parallel heat conducting plates with spacing elements and a hydrophilic layer to facilitate direct heat conduction between primary and secondary channels, combined with boundary layer disrupting formations like louvres to enhance turbulent flow and minimize thermal isolation, allowing for efficient heat transfer without the need for a membrane.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a hydrophilic layer is provided on the wetted secondary surface to supply moisture to the working air stream, then evaporation efficiency is improved, but thermal isolation of the secondary surface from the working air stream increases, reducing heat transfer
Solution Approach 1:
The patent applies local quality by providing the hydrophilic layer only on the secondary surface where moisture supply is needed, while keeping the primary surface and heat conduction paths thermally conductive. This localized application allows the hydrophilic property to enhance evaporation efficiency at the wetted surface without causing thermal isolation across the entire heat exchanger structure.
Solution Approach 2:
The patent uses composite materials by combining the hydrophilic layer with thermally conductive substrates. The hydrophilic layer is applied on a surface that maintains good thermal contact with the heat conducting elements, creating a composite structure that simultaneously provides moisture supply capability and thermal conduction path.
2Strength
If adhesive components are used to attach heat transfer elements to the membrane, then structural integrity is improved, but heat transmission between the elements and membrane deteriorates
Solution Approach 1:
The patent extracts the adhesive component from the heat transfer path by using mechanical attachment methods such as clips, clips, or support structures to hold the heat transfer elements in place. This elimination of adhesive layers removes the thermal resistance that would otherwise be introduced by bonding materials, maintaining high heat conduction coefficient while still ensuring structural integrity through alternative attachment mechanisms.
3Use of energy by moving object
If conventional membrane structures are used to separate primary and secondary flows, then flow separation is improved, but heat transfer efficiency deteriorates due to thermal isolation
Solution Approach 1:
The patent segments the heat exchanger into distinct primary and secondary flow channels separated by a permeable membrane with hydrophilic properties. This segmentation allows independent control and optimization of each flow path while maintaining efficient heat and mass transfer through the membrane. The membrane structure provides flow separation necessary for independent stream management while the hydrophilic layer enables evaporation-driven heat transfer that overcomes the thermal isolation problem of conventional membranes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat transfer efficiency by allowing direct conduction between plates, reducing thermal isolation, and maintaining high heat transfer coefficients while minimizing pressure drop, enabling cooling below dew point temperatures with improved operational versatility.
Implementation Method 1
heat transmission between the primary and secondary channels can take place primarily by conduction along the plates from the region associated with the primary channels to the regions associated with the secondary channels
Implementation Method 2
evaporation of a fluid into a secondary or working air stream
Implementation Method 3
uses the latent heat of evaporation of a liquid to provide cooling
Implementation Method 4
boundary layer disrupting formations like louvres to enhance turbulent flow
Data Source
AI summary
A evaporative cooling device is described having a pair of heat conducting plates arranged in spaced, generally parallel relationship with spacing elements separating the plates from one another and defining primary and secondary flow channels between the plates. Inlet ducts are connected to the primary channels and outlet ducts connect from the primary and secondary channels. A water distribution system is also provided to supply water to the secondary channels such that a primary air flow through the primary channels may be cooled by heat conduction along the plates to cause evaporation of the water into a secondary air flow through the secondary channels.