Evaporative Cooling Plate for High-Performance CPU Heat Dissipation
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Solution Overview
Problem
As electronic devices with powerful CPUs and highly integrated circuits generate more heat, existing cooling solutions are inadequate for effective heat dissipation, leading to performance limitations.
Innovation Solution
A cooling plate design featuring copper plates with a cavity filled with Methyl Nonafluorobutyl Ether or Ethyl Nonafluorobutyl Ether cooling liquid, which evaporates at one end and condenses at the other, facilitating efficient heat transfer without the need for a wick structure, thus integrating seamlessly with electronic devices for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional cooling solutions are used, then the structure is simple, but the heat dissipation performance is insufficient
Solution Approach 1:
The patent utilizes phase transition of cooling liquid (evaporation and condensation) to achieve efficient heat dissipation. The cooling liquid evaporates at the first end absorbing heat from the CPU, then condenses at the second end releasing heat, creating a continuous heat transfer cycle that significantly improves heat dissipation performance compared to traditional solid cooling solutions.
Solution Approach 2:
The patent employs a closed-loop liquid cooling system where cooling liquid circulates through the cavity between plates. This hydraulic approach allows continuous heat carrier circulation, enabling sustained high-performance heat dissipation that overcomes the limitations of passive solid cooling methods.
2Temperature
If a wick structure is added to facilitate cooling liquid circulation, then the heat transfer efficiency improves, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent achieves self-service cooling liquid circulation through phase transition-driven natural convection. The evaporation and condensation process creates density differences that automatically drive the cooling liquid flow without requiring external pumps or complex wick structures. The system uses its own thermal energy to sustain circulation, eliminating additional components.
Solution Approach 2:
The patent extracts and eliminates the wick structure from traditional heat pipe designs, relying instead on the phase transition of the cooling liquid itself to drive circulation. This simplification removes unnecessary components while maintaining effective heat transfer through the fundamental thermodynamic process of evaporation and condensation.
3Temperature
If conventional cooling methods are used, then the manufacturing cost is low, but the heat dissipation capability is insufficient for high-performance CPUs
Solution Approach 1:
The patent employs composite construction with copper plates providing structural support and thermal conduction, while the cooling liquid (such as deionized water or ethylene glycol solution) provides phase transition-based heat transfer. This composite approach combines the advantages of solid structural integrity with liquid heat transfer efficiency, achieving superior heat dissipation capability.
Solution Approach 2:
The patent leverages the phase transition properties of common cooling liquids to achieve high heat dissipation capability. The latent heat of vaporization during evaporation and condensation provides intensive heat transfer that far exceeds conventional conduction-based cooling, enabling effective cooling for high-performance CPUs without requiring exotic or expensive materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides effective heat dissipation with high heat transfer rates and low costs, improving the performance and efficiency of electronic devices by directly absorbing and dissipating heat from the source.
Implementation Method 1
The cooling liquid 50 can be evaporated in the first end A and can be condensate in the second end B of the cooling plate 100
Implementation Method 2
The cooling liquid 50 can be evaporated in the first end A and can be condensate in the second end B of the cooling plate 100
Implementation Method 3
facilitating efficient heat transfer without the need for a wick structure
Data Source
AI summary
A cooling plate of a first embodiment of the present disclosure is configured with a electronic device for heat dissipation. The cooling plate of the first embodiment disclosure includes a first plate, a second plate opposite to the first plate, a bonding line connected with the first plate and the second plate, a plurality of supporting columns, and a cooling liquid received between the first plate and the second plate. The first plate, the second plate, and the bonding line together define a cavity, the plurality of supporting columns and the cooling liquid are received in the cavity. The plurality of supporting columns connects perpendicularly with the first plate and the second plate. The cooling liquid communicates between the plurality of the supporting columns.