Evaporative Cooling for Memory Modules
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Solution Overview
Problem
Current cooling solutions for computer memory modules are inefficient, consuming excessive space and power, and failing to adequately cool memory in dense systems like laptops and servers, leading to performance and reliability issues due to heat generation.
Innovation Solution
The implementation of low-profile evaporative cooling systems using heat pipes and vapor chambers integrated into memory assemblies, which are configured to maintain a compact form factor and distribute heat uniformly, allowing for effective cooling within the limited space of dense enclosures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fans and cooling solutions are added to cool memory, then heat dissipation is improved, but device complexity and space consumption increase
Solution Approach 1:
The patent combines the cooling function with the memory module structure itself by integrating heat pipes and vapor chambers directly into the memory assembly. This merging eliminates the need for separate cooling components and reduces overall system complexity while maintaining effective heat dissipation.
Solution Approach 2:
The cooling components (heat pipes, vapor chambers) are nested within the memory module form factor, with the heat pipes positioned between the memory chips and the vapor chamber. This nesting allows the cooling system to be contained within the standard memory module dimensions without protruding externally.
2Temperature
If fans are increased in number and flow rate to improve cooling, then heat dissipation is improved, but power consumption and acoustic noise increase
Solution Approach 1:
The patent replaces mechanical cooling systems (fans) with a passive thermal conduction system using heat pipes and vapor chambers. This substitution eliminates the need for moving parts and external power sources, achieving effective cooling through phase change and thermal conduction alone.
Solution Approach 2:
The heat pipes and vapor chambers are self-regulating thermal management systems that automatically transport heat from the memory chips without requiring external control or power input. The phase change process occurs naturally based on temperature gradients, making the system self-service and energy-independent.
3Temperature
If cooling solutions are added to memory modules, then heat dissipation is improved, but the form factor and footprint increase
Solution Approach 1:
The patent utilizes the internal three-dimensional space within the memory module by positioning heat pipes vertically between the memory chips and the vapor chamber. This dimensional arrangement allows effective cooling without increasing the module's external footprint, as the cooling components are distributed throughout the internal volume rather than adding to external dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat without increasing the form factor of memory modules, improving performance and reliability in dense systems by maintaining a low profile and reducing acoustic noise and power consumption.
Implementation Method 1
The evaporative cooling modules 16 may include one or more heat pipes
Implementation Method 2
The evaporative cooling modules 16 may include one or more vapor chambers
Implementation Method 3
one or more evaporative cooling modules 16
Data Source
AI summary
A system, in one embodiment, may include an in-line memory module with a plurality of memory circuits disposed on a circuit board, wherein the circuit board may have an edge connector with a plurality of contact pads. The system also may include a heat spreader disposed along the plurality of memory circuits. Finally, the system may include a heat pipe, a vapor chamber, or a combination thereof, extending along the heat spreader. In another embodiment, a system may include a heat spreader configured to mount to an in-line memory module, and an evaporative cooling system at least substantially contained within dimensions of the heat spreader.