Evaporator Heat Exchanger Integration for Constant Concentration

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Solution Overview

Problem

Conventional bubbler systems in the semiconductor and fiber optics industries face challenges in maintaining consistent vapor concentration due to temperature and pressure fluctuations, leading to non-uniform product quality.

Innovation Solution

A device comprising an evaporator and a heat exchanger in close proximity to maintain temperature variations of the precursor within ±0.5°C, despite ambient temperature fluctuations of up to ±35°C, by directly connecting the heat exchanger to the evaporator and minimizing piping, ensuring consistent precursor supply and reduced pressure fluctuations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the heat exchanger is placed farther from the evaporator to simplify installation, then ease of installation is improved, but temperature stability deteriorates due to longer fluid paths and greater ambient temperature influence

Engineering Contradiction:
Improveease of installationVSAvoidtemperature stability
Core Design Contradiction:
Ease of operationVSTemperature

Solution Approach 1:

The patent introduces a heated enclosure (incubator) as an intermediary environment that surrounds the evaporator and maintains a controlled temperature atmosphere. This mediator protects the precursor fluid from ambient temperature fluctuations, allowing the heat exchanger to be positioned at a practical distance while maintaining temperature stability through the controlled environment rather than relying solely on proximity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If the fluid path between heat exchanger and evaporator is lengthened to facilitate system design, then device complexity is reduced, but manufacturing precision deteriorates due to increased temperature variations

Engineering Contradiction:
Improvesystem design flexibilityVSAvoidfilm uniformity
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent changes the thermal parameter of the fluid path by introducing active heating elements and insulation along the precursor delivery path. This transforms the previously passive, temperature-variable fluid path into an actively controlled thermal pathway, maintaining consistent precursor temperature even over longer distances, thereby ensuring film uniformity while allowing greater design flexibility.

Inventive Principle:
Principle #35Parameter changes

3Use of energy by moving object

If ambient temperature control is relaxed to reduce energy consumption, then energy efficiency is improved, but temperature stability deteriorates affecting vapor concentration

Engineering Contradiction:
Improveenergy consumptionVSAvoidtemperature stability
Core Design Contradiction:
Use of energy by moving objectVSTemperature

Solution Approach 1:

The patent applies preliminary action by pre-heating or pre-cooling the precursor fluid in the heat exchanger before it enters the evaporator, and by pre-establishing the thermal environment through insulation and controlled enclosure. This preliminary thermal conditioning ensures that the precursor maintains stable temperature throughout its path, reducing the need for continuous high-energy temperature correction and improving overall energy efficiency.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures reproducible and uniform metal-containing film deposition by minimizing temperature and pressure variations, resulting in high-quality, consistent products over extended periods.

Implementation Method 1

A device comprising an evaporator and a heat exchanger in close proximity to maintain temperature variations of the precursor within ±0.5°C

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Implementation Method 2

by directly connecting the heat exchanger to the evaporator and minimizing piping

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

A carrier fluid is introduced into the fluid column, travels up through, and exits the precursor surface into a headspace. As the carrier fluid passes through the fluid column it becomes entrained with vapor

Methodology Applied
Scientific EffectEvaporation: Evaporation

Implementation Method 4

a carrier fluid enters the bubbler, passes through the precursor, becomes saturated with the precursor

Methodology Applied
Scientific EffectAbsorption: Absorption (physical)

Implementation Method 5

The precursors are delivered to a deposition reactor and deposited on a substrate to form a metal-containing film

Methodology Applied
Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Data Source

PatentEP2345473B1Device and method for constant concentration evaporation
Publication Date: 2016.10.12 CERES TECHNOLOGIES INC
  • EP2345473B1 patent drawingFigure 1(A)~1(B)
  • EP2345473B1 patent drawingFigure 2

AI summary

Disclosed herein is a device comprising an evaporator; and a heat exchanger; the heat exchanger being in fluid communication with evaporator; evaporator comprising an outer casing; and an inner casing that is disposed within the outer casing; the inner casing contacting a plate; wherein the inner casing encloses a first conduit that is operative to introduce a carrier fluid into evaporator; and a second conduit that is operative to remove carrier fluid entrained with a precursor; wherein the outer casing is detachably attached to the plate; the plate contacting a first precursor conduit that is operative to introduce the precursor into evaporator from the heat exchanger; where the heat exchanger is disposed proximate to evaporator at a distance effective to maintain the precursor in evaporator at a substantially constant temperature when the ambient temperature around the heat exchanger and evaporator fluctuates by an amount of up to about ± 35°C.