Evaporator Planet Substrate Loading via Robotic Arm and Aligner
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Solution Overview
Problem
Thin semiconductor substrates with average thicknesses less than 40 microns face challenges during processing due to die handling and metal layer formation, as they can break easily and overheat during sputtering processes, requiring a method to safely load and process these substrates without carriers or cooling tools.
Innovation Solution
Implementing a robotic arm system with sensors and vacuum capabilities to automatically load and unload substrates into an evaporator dome, using evaporation processes that avoid plasma formation and overheating, and employing a substrate aligner for precise positioning and handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thin semiconductor substrates are processed using conventional sputtering methods, then metal layers can be formed on the substrates, but the substrates overheat and break due to their thinness
Solution Approach 1:
The patent changes the processing parameters by switching from sputtering to evaporation deposition, which operates at lower temperatures and avoids plasma formation. This parameter change allows metal layers to be formed on thin substrates without causing overheating and breakage
Solution Approach 2:
The patent replaces the mechanical sputtering process with an evaporation-based deposition system that uses a different physical mechanism (thermal evaporation instead of plasma sputtering), thereby avoiding the harmful thermal effects on thin substrates
2Ease of operation
If thin substrates are handled manually or with conventional tools, then substrates can be loaded and unloaded, but the substrates break easily due to their fragility
Solution Approach 1:
The patent introduces a specialized substrate handling system with custom fixtures and alignment mechanisms that act as intermediaries between the robotic arm and the thin substrates. This intermediary system provides support and protection during loading and unloading operations, preventing breakage
Solution Approach 2:
The patent divides the substrate handling process into discrete, controlled steps using a robotic system that can precisely position and manipulate substrates. The handling system is segmented into separate functions (loading, positioning, deposition, unloading) that can be optimized independently to protect thin substrates
3Productivity
If automated robotic systems are used to load substrates, then processing efficiency increases, but the complexity of the system increases
Solution Approach 1:
The patent designs a multi-functional robotic system that can perform multiple operations (substrate loading, positioning, deposition, and unloading) using a single integrated platform. This universal system reduces overall complexity compared to having separate specialized equipment for each function while maintaining high productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The robotic arm system effectively loads and unloads thin substrates into the evaporator dome, preventing breakage and overheating, allowing for reliable metal layer formation on thin substrates without the need for carriers or cooling tools, enhancing processing efficiency and yield.
Implementation Method 1
using a robotic arm with sensors and vacuum capabilities to automatically load and unload substrates
Implementation Method 2
using evaporation processes that avoid plasma formation and overheating
Data Source
AI summary
Implementations of methods of loading an evaporator may include, using a robotic arm, removing a substrate from a cassette and centering the substrate on a substrate aligner. The method may include aligning the substrate using the substrate aligner. The substrate may also include removing the substrate from the substrate aligner using the robotic arm and loading the substrate into a first available pocket of a planet of an evaporator using the robotic arm. The method may also include rotating the planet to a second available pocket after detecting a presence of the substrate in the first available pocket.