EVI Refrigeration Branch for Transport Electronics Heat Dissipation
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Solution Overview
Problem
Transport refrigeration vehicles face challenges in efficiently dissipating heat from increasing numbers of electronic components like transformers and inverters, as existing heat dissipation methods require larger radiators that consume precious space and load, especially under extreme temperatures.
Innovation Solution
A refrigeration system that integrates a main refrigeration circuit with an electronic component heat dissipation circuit, where refrigerant from the main circuit exchanges heat with a cooling medium in the electronic component heat dissipation circuit, using throttling elements dynamically controlled by temperature to optimize heat transfer without impacting the main refrigeration circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a fan-based radiator is used for heat dissipation of electronic components, then heat dissipation effectiveness is improved, but the size of the radiator increases
Solution Approach 1:
The patent merges the electronic component heat dissipation function with the existing refrigeration system by integrating an associated heat exchanger into the refrigeration circuit. The refrigerant from the refrigeration system directly cools the electronic components through the heat exchanger, combining two cooling functions (refrigeration and electronics cooling) into a single integrated system, thereby eliminating the need for a separate large radiator.
Solution Approach 2:
The refrigeration system is designed to perform multiple functions: it provides refrigeration for the storage compartment and simultaneously serves as a heat dissipation system for electronic components. The refrigerant circulates through both the evaporator for refrigeration and the associated heat exchanger for electronics cooling, making the system universal and eliminating the need for dedicated electronic cooling equipment.
2Reliability
If the radiator size is increased to cope with extreme temperatures, then heat dissipation capacity is improved, but the space and load on the vehicle increase
Solution Approach 1:
The patent combines the electronic component cooling function with the refrigeration system by integrating the associated heat exchanger into the refrigeration circuit. This merger allows the refrigerant to serve dual purposes: providing refrigeration and cooling electronic components, thereby eliminating the need for additional heavy cooling equipment and reducing overall vehicle load.
Solution Approach 2:
The refrigeration system serves itself by using its own refrigerant to cool the electronic components. The refrigerant, after absorbing heat from the storage compartment, passes through the associated heat exchanger where it absorbs additional heat from the electronic components before returning to the compressor. This self-service approach eliminates the need for separate cooling systems and reduces vehicle weight.
3Reliability
If the radiator size is increased to cope with extreme temperatures, then heat dissipation capacity is improved, but the space on the vehicle increases
Solution Approach 1:
The patent merges the electronic component heat dissipation function with the existing refrigeration system by integrating an associated heat exchanger into the refrigeration circuit. This integration allows the system to cool electronic components using the refrigerant already circulating in the refrigeration system, thereby eliminating the need for a separate large radiator and preserving valuable vehicle space.
4Adaptability or versatility
If more electronic components are added to the vehicle, then functionality is improved, but heat dissipation demand increases
Solution Approach 1:
The refrigeration system is designed with multi-functionality to handle both refrigeration and electronic component cooling. The associated heat exchanger is integrated into the refrigeration circuit, allowing the refrigerant to absorb heat from electronic components in addition to providing refrigeration. This universal design enables the system to accommodate increased electronic component heat dissipation demands without requiring additional cooling capacity.
Solution Approach 2:
The system dynamically adjusts to varying heat dissipation demands through the expansion valve that controls refrigerant flow to the associated heat exchanger. When electronic components generate more heat, the expansion valve increases refrigerant flow to the heat exchanger, automatically balancing the thermal load without requiring oversizing of the cooling system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides effective heat dissipation for electronic components under extreme temperatures without increasing the size of the refrigeration system, ensuring efficient operation and compact design.
Implementation Method 1
cooling medium in the electronic component heat dissipation circuit exchanges heat with refrigerant from a first branch of the main refrigeration circuit
Implementation Method 2
the first branch is in communication with an EVI inlet of the compressor through a first throttling element
Data Source
AI summary
The refrigeration system comprises: a main refrigeration circuit comprising a compressor, a condenser, a main throttling element, and an evaporator that are sequentially connected, where the evaporator is configured to provide refrigeration to a storage compartment of the transport refrigeration vehicles; an electronic component heat dissipation circuit configured to provide heat dissipation for electronic components; wherein, the electronic component heat dissipation circuit comprises an associated heat exchanger, in which refrigerant in the electronic component heat dissipation circuit exchanges heat with refrigerant from a first branch of the main refrigeration circuit, where the first branch extends from between the condenser and the main throttling device on the main refrigeration circuit, and is in communication with an EVI inlet of the compressor through a first throttling element and the associated heat exchanger.