EVOH Resin Composition with Polyamide Network for Retort Packaging
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Solution Overview
Problem
Saponified ethylene-vinyl ester copolymer (EVOH resin) films used for packaging lose gas barrier properties and undergo resin elution when subjected to hot water treatments like retort sterilization, especially when drying agents or polyamide resin content is insufficient, affecting processability and gas barrier retention.
Innovation Solution
A resin composition combining EVOH resin with a polyamide resin and an inorganic salt capable of forming hydrates, where the inorganic salt is present in 2-50 parts by mass and the polyamide resin to inorganic salt ratio is between 95/5 to 5/95, forming a network structure that encloses the inorganic salt to prevent EVOH resin elution during hot water treatments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a drying agent is added to suppress water absorption, then gas barrier property is improved, but EVOH resin elution is increased
Solution Approach 1:
The patent introduces polyamide resin as an intermediary substance between EVOH resin and inorganic drying agents. The polyamide resin forms a network structure that encapsulates the inorganic salt, allowing the drying agent to function while preventing direct contact between inorganic salt and EVOH resin, thus suppressing elution. This mediator approach resolves the contradiction by enabling the drying agent effect without the harmful elution side effect.
Solution Approach 2:
The patent creates a composite resin composition combining EVOH resin, polyamide resin, and inorganic salt in specific ratios (polyamide resin 1-25 parts, inorganic salt 2-50 parts based on 100 parts EVOH resin). This composite structure leverages the gas barrier properties of EVOH, the network-forming capability of polyamide resin, and the drying agent function of inorganic salt, achieving both improved gas barrier property and suppressed elution through material composition.
2Reliability
If polyamide resin content is increased to suppress elution, then EVOH resin retention is improved, but long-run processability is lowered
Solution Approach 1:
The patent optimizes the content parameters of polyamide resin (1-25 parts by mass per 100 parts EVOH resin) and inorganic salt (2-50 parts by mass per 100 parts EVOH resin) to achieve the desired balance. By controlling these parameters within specific ranges, the patent achieves sufficient elution suppression while maintaining acceptable processability, resolving the contradiction through parameter optimization.
Solution Approach 2:
The patent applies polyamide resin locally as a network-forming component rather than uniformly throughout the entire composition. The polyamide resin forms a localized network structure that encapsulates inorganic salt and prevents elution, while the bulk EVOH resin maintains its processing characteristics. This localized application of polyamide resin's function resolves the contradiction between elution suppression and processability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively suppresses EVOH resin elution and maintains gas barrier properties even under hot water treatment conditions, enhancing long-run processability and preventing gas barrier property degradation.
Implementation Method 1
an inorganic salt (C) capable of forming a hydrate
Implementation Method 2
the inorganic salt (C) sufficiently functions as a drying agent in hot water treatment
Implementation Method 3
A network structure is formed by a molecular interaction between EVOH resin and polyamide resin
Data Source
AI summary
It is disclosed that a resin composition comprising EVOH resin (A), polyamide resin (B) and inorganic salt (C) capable of forming a hydrate wherein the content amount of the inorganic salt (C) is in the range of 2 to 50 parts by mass based on 100 parts by mass of the EVOH resin (A), and the mass ratio ((B)/(C)) of the polyamide resin (B) to the inorganic salt (C) is in the range of 95/5 to 5/95. The resin composition exhibits excellent gas barrier property and less elution of EVOH resin even after hot water treatment, and excellent long-run processability.


