eVTOL Casing Cooling With Embedded Pulsating Heat Pipes

The patent employs pulsating heat pipes that utilize phase transitions of the working fluid between liquid and vapor states to transport heat. The evaporator section converts liquid to vapor absorbing heat from electronics, the vapor travels to the condenser section where it condenses back to liquid releasing heat, and the liquid returns to the evaporator. This phase change mechanism enables efficient heat spreading throughout the casing surface while maintaining a relatively simple overall structure.

The pulsating heat pipe system uses fluid dynamics and pressure variations to drive the circulation of working fluid through the closed-loop channel. The pulsating flow of liquid and vapor creates pressure waves that propel the phase-change process, enabling passive heat transport without external pumps or complex control systems, thus achieving effective cooling with minimal structural complexity.

The pulsating heat pipe acts as an intermediary heat transfer device between the heat source (electronic components) and the casing surface. The working fluid within the PHP serves as a mobile mediator that absorbs heat at the evaporator near the electronics and transports it through phase change to the condenser sections distributed across the casing surface, enabling uniform heat spreading without requiring direct thermal contact across the entire casing.

The patent transitions from two-dimensional heat conduction through the casing wall to three-dimensional heat transport by embedding the pulsating heat pipe channel within the casing structure. The PHP creates internal heat transport pathways that extend throughout the casing volume, allowing heat to be distributed across multiple dimensions of the casing surface rather than relying solely on surface conduction.

The pulsating heat pipe integrates multiple heat transfer functions into a single unified component. The evaporator, condenser sections, and return channel are merged into one continuous closed-loop structure embedded within the casing. This consolidation provides high cooling capacity equivalent to multiple separate cooling devices while maintaining a simple integrated structure that utilizes the existing casing space efficiently.

The pulsating heat pipe performs multiple heat transfer functions simultaneously: heat absorption at the evaporator, heat transport through phase change, heat release at condenser sections, and fluid return. This multi-functionality allows a single component to replace what would traditionally require multiple separate cooling devices, achieving high cooling capacity without proportional increases in system complexity or space requirements.