EUVL Mask Coupling Module for Charge Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
EUVL masks require effective inspection during manufacturing and utilization to prevent defects on silicon wafers, but existing methods struggle with electrical charge buildup during electron-beam or ion-beam imaging due to the conductive nature of the upper portion of the mask.
Innovation Solution
A coupling module is introduced that provides a conductive path between the EUVL mask and the chuck, using conductive elements and an intermediate element to contact the mask outside the pattern transfer area, preventing charge buildup by grounding the mask and reducing the risk of electrical arcs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If electron-beam or ion-beam imaging is used to inspect EUVL masks, then inspection capability is improved, but electrical charge buildup occurs on the conductive upper portion of the mask
Solution Approach 1:
The coupling module serves as an intermediary device between the EUVL mask and the inspection equipment. It provides a dedicated electrical connection path through its conductive elements that allows charge dissipation without interfering with the optical inspection process. The intermediate element mechanically and electrically couples the mask contact elements to the chuck contact elements, enabling safe charge discharge.
Solution Approach 2:
The coupling module creates an equipotential connection between the conductive upper portion of the mask and the grounded chuck. By providing a low-impedance electrical path, it equalizes the electrical potential, preventing charge accumulation and eliminating the harmful electrostatic effects that would otherwise occur during electron-beam or ion-beam imaging.
2Manufacturing precision
If the upper portion of the EUVL mask is made conductive for pattern formation, then lithography performance is improved, but electrical arcs and damage risk increase during inspection
Solution Approach 1:
The coupling module acts as a protective intermediary that mediates the electrical interaction between the conductive mask and the inspection environment. It provides a controlled discharge path that prevents uncontrolled electrical arcs while maintaining the necessary conductive properties for high-performance lithography.
Solution Approach 2:
The coupling module provides beforehand protection by establishing a safe electrical connection path before inspection begins. The spring-loaded mask contact elements ensure reliable electrical contact is made in advance, cushioning against potential electrical arcs and damage during the inspection process.
3Reliability
If mask contact elements are positioned to contact the upper portion of the mask, then electrical connection is improved, but contact with the pattern transfer area must be avoided
Solution Approach 1:
The coupling module applies local quality by differentiating the contact locations: the mask contact elements are positioned to contact only the peripheral areas of the mask that surround the pattern transfer area. This localized contact strategy ensures reliable electrical connection while preserving the integrity of the critical pattern transfer region.
Solution Approach 2:
The coupling module segments the mask contact function from the pattern transfer function. By positioning contact elements only in peripheral zones and using an intermediate element to bridge the connection, it separates the electrical grounding function from the optical pattern formation function, preventing interference between them.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coupling module ensures reliable electrical connection and prevents charge accumulation, allowing for accurate inspection of EUVL masks without damage, thereby enhancing the quality of pattern transfer and reducing defects on silicon wafers.
Implementation Method 1
The at least one mask contact element may comprise a spring.
Implementation Method 2
The coupling module provides at least one conductive path between the upper portion of the EUVL mask and the chuck
Data Source
AI summary
A coupling module may include an upper portion that defines an aperture, mask contact elements, chuck contact elements and an intermediate element that is connected between the mask contact elements and the upper portion. A shape and a size of the aperture may correspond to a shape and size of a pattern transfer area of an extreme ultra violet (EUVL) mask. The coupling module may be shaped and sized so that once the mask contact elements contact the upper portion of the EUVL mask, the chuck contact elements contact a chuck that supports the mask. The coupling module may further provide at least one conductive path between the upper portion of the EUVL mask and the chuck when the EUVL mask is positioned on the chuck.


