EWS Leaf Spring Cooling Jacket for DIMM Thermal Management
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Solution Overview
Problem
High-performance computer systems, such as servers, face challenges in thermal management due to increased heat dissipation from advanced memory technologies, which is exacerbated by space constraints and the inefficiency of conventional cooling mechanisms for densely packed dual in-line memory modules (DIMMs).
Innovation Solution
The Edgewater Spring (EWS) cooling apparatus, featuring a thin, cascaded row structure of leaf springs, provides direct thermal conduction and contact with DIMMs without additional clips or adhesives, allowing for efficient heat transfer and installation in tight spaces, using cost-effective materials like copper for improved thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling mechanisms are used for densely packed DIMMs, then cooling coverage is provided, but space constraints are violated and thermal efficiency deteriorates
Solution Approach 1:
The cooling apparatus is divided into multiple cascaded rows of leaf springs, where each row contacts a specific region of the DIMM. This segmentation allows the cooling structure to adapt to the densely packed DIMM configuration while maintaining effective thermal contact across the entire memory module surface.
Solution Approach 2:
The cooling apparatus transitions from a conventional two-dimensional planar contact to a three-dimensional cascaded structure that wraps around the DIMM. This dimensional change enables the cooling solution to fit within tight spatial constraints while maximizing thermal contact area through vertical layering.
2Reliability
If additional clips or adhesives are used to secure cooling apparatus, then attachment reliability is improved, but device complexity and installation time increase
Solution Approach 1:
The leaf springs are designed to automatically clamp onto the DIMM through their inherent elastic deformation. The springs self-adjust to the DIMM dimensions and secure the cooling apparatus without requiring external clips, adhesives, or additional fastening mechanisms, thereby simplifying the overall structure and installation process.
3Volume of moving object
If thin profile cooling apparatus is used to fit tight spaces, then space efficiency is improved, but thermal conduction effectiveness may deteriorate
Solution Approach 1:
The cooling apparatus utilizes copper or copper alloy materials that provide superior thermal conductivity despite the thin profile. The high thermal conductivity of copper compensates for the reduced thickness, ensuring effective heat transfer from the DIMM while maintaining a space-efficient design that fits within tight packaging constraints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The EWS cooling apparatus effectively manages thermal issues in high-density memory systems by enabling efficient heat removal from DIMMs, reducing installation time, and minimizing costs, while maintaining reliability and compatibility with various DIMM configurations.
Implementation Method 1
provide heat removal via thermal conduction
Data Source
AI summary
Systems and apparatus are provided for thermal cooling of integrated circuits, such as dual in-line memory modules (DIMMs). The apparatus includes a plurality of rows pieces that include individual leaf springs. Each of the leaf springs can exert compression to support thermal contact and a stable coupling with a received DIMM. The plurality of row pieces can be assembled to form a single structure, having a space to receive an individual DIMM for insertion. Further, each of the leaf springs are structured to allow a portion of its surface, having a conductive material disposed thereon, to support transfer of heat away from the DIMM at a point of thermal contact. The apparatus can be coupled to a printed circuit assembly (PCA) having additional cooling mechanisms installed thereon, in a manner that allows the additional cooling mechanisms to be integrated with the apparatus and provide increased thermal cooling for the DIMMs.