Exchangeable Dispense Module Kit for Flexible Surface Treatment
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Solution Overview
Problem
Conventional modular processing apparatuses for semiconductor manufacturing lack the ability to rapidly adjust processing configurations based on individual substrate requirements without major hardware changes.
Innovation Solution
A module kit for chemical and/or electrolytic surface treatment of substrates, featuring a process chamber with interchangeable dispense units and standardized interfaces, allowing quick and easy modification of processing configurations without adjusting liquid supply and drain connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional modular processing apparatuses are used with fixed hardware configurations, then structural stability is maintained, but the ability to rapidly adjust processing configurations for different substrates is poor
Solution Approach 1:
The processing apparatus is divided into modular components: exchangeable dispense units that can be quickly swapped, standardized interfaces that remain fixed, and configurable liquid delivery systems. This segmentation allows the adaptable portions (dispense units) to be changed without affecting the stable portions (interfaces, liquid supply system), resolving the contradiction between adaptability and complexity.
Solution Approach 2:
The standardized kit interface and liquid supply system are designed with universal compatibility to work with multiple different dispense units and substrate types. This universal design enables a single hardware platform to support various processing configurations through software and unit exchanges rather than hardware modifications, improving adaptability while maintaining structural simplicity.
2Productivity
If exchangeable dispense units are implemented with standardized interfaces, then adjustment speed is improved, but interface design complexity increases
Solution Approach 1:
The standardized interfaces are pre-designed and pre-configured before actual substrate processing begins. Connection protocols, liquid delivery pathways, and mechanical interfaces are established in advance, allowing dispense units to be quickly exchanged and immediately operational without complex on-the-fly configuration, thus improving adjustment speed while containing interface complexity through upfront design.
3Adaptability or versatility
If the process chamber is designed to receive different sized substrates, then substrate size versatility is improved, but space utilization efficiency decreases
Solution Approach 1:
The process chamber incorporates dynamic, adjustable elements such as movable walls, adjustable substrate holders, and flexible positioning systems that can be reconfigured for different substrate sizes. This dynamic adaptability allows the chamber to efficiently accommodate various substrate dimensions without requiring a excessively large fixed volume, resolving the contradiction between versatility and space utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible and reliable substrate treatment with high chemical selectivity, scalability, and low operational costs, supporting various substrate sizes and shapes, and facilitating rapid adaptation to process-specific requirements.
Implementation Method 1
a first exchangeable dispense unit for dispensing a first liquid on the substrate, and a second exchangeable dispense unit for dispensing a second liquid on the substrate
Implementation Method 2
The kit interface, the first inlet interface and the second inlet interface are configured for an exchangeable cooperation either between the kit interface and the first inlet interface or between the kit interface and the second inlet interface
Data Source
AI summary
The present invention relates to a module kit for a chemical and/or electrolytic surface treatment of a substrate, a platform assembly comprising such a module kit, a method for a chemical and/or electrolytic surface treatment of substrates and a use of such a module kit. The module kit comprises a process chamber, a first exchangeable dispense unit for dispensing a first liquid on the substrate, and a second exchangeable dispense unit for dispensing a second liquid on the substrate. The process chamber is dimensioned to receive either the first exchangeable dispense unit or the second exchangeable dispense unit. The first exchangeable dispense unit and the second exchangeable dispense unit are each dimensioned to receive the substrate. The process chamber comprises a kit interface for supplying the first liquid or the second liquid. The first exchangeable dispense unit comprises a first inlet interface for the first liquid. The second exchangeable dispense unit comprises a second inlet interface for the second liquid. The kit interface, the first inlet interface and the second inlet interface are configured for an exchangeable cooperation either between the kit interface and the first inlet interface or between the kit interface and the second inlet interface.