Exchangeable Electronics Assemblies Insertion-Direction Cooling

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Solution Overview

Problem

Existing systems for cooling components within electrical devices face challenges in achieving efficient thermal connection, particularly in the insertion direction, which affects the overall heat dissipation and device performance.

Innovation Solution

The proposed solution involves a device that transfers heat between exchangeable electronics assemblies and the housing in the insertion direction, utilizing a cooler arranged between the circuit board and the electronics assembly, and employing heat-conducting elements with surfaces oriented in parallel to the insertion direction for effective heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat is transferred laterally between the electronics assembly and the housing, then the thermal connection can be established, but the thermal resistance is relatively high due to misalignment with the insertion direction

Engineering Contradiction:

Improvethermal resistanceVSAvoidthermal connection structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

Instead of transferring heat laterally perpendicular to the insertion direction, the patent inverts the approach by transferring heat in the insertion direction itself. The heat-conducting element is arranged to extend in the insertion direction, aligning the thermal contact with the mechanical fastening direction, thereby reducing thermal resistance without complicating the structure.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent changes the dimension of heat transfer from lateral (perpendicular to insertion) to longitudinal (parallel to insertion). By orienting the heat-conducting element along the insertion direction, the thermal path is optimized to match the mechanical assembly direction, achieving low thermal resistance with a simple structural arrangement.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If the cooler is positioned away from the heat-generating electronics component, then the structure is simpler, but the heat-conducting element becomes larger and less efficient

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidheat-conducting element size

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The heat-conducting element acts as an intermediary between the cooler and the electronics component. By positioning the cooler close to the heat-generating component and using the heat-conducting element as a thermal bridge, efficient heat transfer is achieved with a compact heat-conducting element size, as the thermal path is minimized.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Temperature

If insufficient surface pressure is applied between the heat-conducting element and the cooler, then the assembly is easier to manufacture, but the thermal contact is insufficient

Engineering Contradiction:

Improvethermal contact qualityVSAvoidassembly process

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The pressing means applies surface pressure in advance during the assembly process to ensure sufficient thermal contact between the heat-conducting element and the cooler. This preliminary action of pressing ensures optimal thermal connection is achieved during assembly, maintaining ease of manufacture while guaranteeing thermal performance.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in low thermal resistance and efficient heat dissipation, as the thermal contact aligns with the electrical and mechanical fastening, ensuring stable and effective cooling of high-performance electronics components.

Implementation Method 1

transfers heat between the exchangeable electronics assembly and the housing in the insertion direction

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the heat-conducting element can be designed to be relatively compact... for dissipating the waste heat generated by the electronics component

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS20250151242A1Device with exchangeable electronics assemblies of a motor vehicle

Publication Date: 2025.05.08 ROBERT BOSCH GMBH

AI summary

A device with exchangeable electronics assemblies of a motor vehicle. The device includes a housing to at least partially enclose the electronics assemblies exchangeable in an insertion direction, an insertion mechanism for receiving the exchangeable electronics assemblies, a front side which is at least partially detachably connected to the housing and via which access to the exchangeable electronics assemblies arranged inside the housing is possible. A rear housing cover and a circuit board which is aligned transversely to an insertion direction of the electronics assemblies and serves to contact the exchangeable electronics assemblies are provided. The electronics assemblies respectively include an electronics component to be cooled and at least one heat-conducting element which is in thermal contact with the electronics component, and for thermally connecting a cooler, the heat-conducting element has a contact surface oriented transversely to the insertion direction, and the cooler arranged in front of the circuit board, when viewed in the insertion direction, for cooling a plurality of electronics assemblies.