Excimer Laser Beam Shaping for Fluence and Scan Width Control
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Solution Overview
Problem
Existing semiconductor exposure apparatuses face challenges in achieving high resolution due to limitations in reducing the wavelength of light sources, and they struggle to efficiently process materials with excimer laser light.
Innovation Solution
A laser processing apparatus with a beam shaping optical system that shapes laser light to create a rectangular irradiated region on a mask, allowing independent adjustment of the radiation width in the long and short edges, and enabling movement of the irradiated region in both directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the wavelength of the light source is reduced to improve resolution, then the resolution is improved, but the availability of suitable light sources is limited
Solution Approach 1:
The patent changes the fundamental parameter of the light source from conventional visible/infrared lasers to excimer laser, utilizing ultraviolet wavelength (248nm or 193nm) to achieve higher resolution while overcoming the limitation of available light sources. This parameter change enables both improved resolution and access to suitable UV light sources.
2Adaptability or versatility
If excimer laser light is used to process materials, then materials difficult to process with visible or infrared laser light can be processed, but the radiation width control and processing efficiency are limited
Solution Approach 1:
The patent introduces dynamic control of the radiation width through the beam shaping optical system, allowing the irradiated region width to be adjusted independently in the long edge direction. This dynamic adjustment capability enables optimization of processing efficiency while maintaining the ability to process difficult materials with excimer laser light.
Solution Approach 2:
The patent segments the control of radiation width into two independent dimensions: the short edge direction (fixed by mask size) and the long edge direction (adjustable by beam shaping optical system). This segmentation allows independent optimization of each dimension, improving overall processing efficiency while maintaining material processability.
3Manufacturing precision
If the radiation width in the long edge direction is reduced to increase fluence, then higher fluence levels are achieved, but the processing time increases
Solution Approach 1:
The patent employs dynamic adjustment of the radiation width in the long edge direction through the beam shaping optical system, allowing real-time optimization of fluence levels. By independently controlling the radiation width without being constrained by mask size, the system achieves precise fluence control while minimizing processing time through optimized beam parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for precise control of the laser processing, enabling higher fluence levels when needed and improving productivity by allowing multiple beam scans while moving the irradiated region, thus overcoming the limitations of existing technologies.
Implementation Method 1
a beam shaping optical system configured to shape laser light in such a way that an irradiated region of a mask configured to block part of the laser light that is a region irradiated with the laser light has a rectangular shape
Implementation Method 2
a projection optical system configured to project a pattern of the mask on the workpiece placed on the placement base
Implementation Method 3
The excimer laser light having photon energy higher than chemical binding energy of a polymer material can unbind the chemically bonded molecules that form the polymer material
Implementation Method 4
Glass, ceramic, and other materials absorb the excimer laser light by a large amount
Data Source
AI summary
A laser processing apparatus includes a placement base on which a workpiece is placed, a beam shaping optical system configured to shape laser light in such a way that a laser light irradiated region of a mask configured to block part of the laser light has a rectangular shape having short edges and long edges, a second radiation width of the irradiated region in the direction parallel to the long edges being changeable independently of a first radiation width of the irradiated region in the direction parallel to the short edges, and the irradiated region being movable in the direction parallel to the long edges, a projection optical system configured to project a pattern of the mask on the workpiece placed on the placement base, and a mover configured to be capable of moving the irradiated region in the direction parallel to the short edges.