Excimer Laser Treatment of Porous Ceramic Coatings

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Solution Overview

Problem

Semiconductor wafer processing chambers face challenges with porous ceramic coatings that lead to loose particles and porosity, which can result in substrate corrosion and reduced plasma processing efficiency due to high porosity levels.

Innovation Solution

A method involving a ceramic layer with a thickness of less than 150 μm is cleaned and treated with a pulsed excimer laser beam at specific energy densities and repetition rates to achieve localized heating, melting, and resolidification without damaging the substrate, thereby reducing porosity and improving the ceramic layer's properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a porous ceramic coating is applied to protect the substrate, then the substrate is protected from corrosion, but the porosity leads to loose particles and reduced plasma processing efficiency

Engineering Contradiction:
Improvesubstrate protectionVSAvoidloose particles and porosity
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies laser-induced phase transition by heating the ceramic coating to melt and resolidify it, transforming the porous structure into a dense, particle-free surface while maintaining the protective function of the coating

Inventive Principle:
Principle #36Phase transitions

Solution Approach 2:

The patent changes the physical and chemical parameters of the ceramic coating through controlled heating, melting, and resolidification processes, altering its density, surface morphology, and structural properties to eliminate porosity and loose particles

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If the ceramic layer is heated to melt and resolidify to reduce porosity, then the porosity is reduced by at least 50%, but the substrate must not be damaged or delaminated

Engineering Contradiction:
Improveporosity reductionVSAvoidcoating adhesion and substrate integrity
Core Design Contradiction:
Manufacturing precisionVSStrength

Solution Approach 1:

The patent applies localized heating to the ceramic coating surface rather than uniform heating of the entire substrate-coating system, concentrating thermal energy only where needed to melt and resolidify the coating while keeping the substrate and coating-back interface below damage temperatures

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent uses pulsed laser heating with controlled duty cycles and repetition rates, applying thermal energy in periodic pulses that allow heat dissipation between pulses, preventing cumulative overheating that could damage the substrate or cause delamination

Inventive Principle:
Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The process effectively reduces porosity by at least 50%, enhances the ceramic layer's density, mechanical properties, and chemical resistance, preventing delamination and corrosion, and improving the substrate's protection within plasma processing chambers.

Implementation Method 1

the pulsed excimer laser beam provides localized heating of the ceramic layer to a temperature that cause the ceramic layer to melt

Methodology Applied
Scientific EffectLocalized heating: Laser

Implementation Method 2

the ceramic layer to melt without damaging or delaminating from the substrate

Methodology Applied
Scientific EffectMelting: Melting

Implementation Method 3

applying ultrasonic energy to the ceramic layer

Methodology Applied
Scientific EffectUltrasonic energy: Ultrasonic Vibration

Data Source

PatentUS10422028B2Surface coating treatment
Publication Date: 2019.09.24 LAM RES CORP
  • US10422028B2 patent drawing
  • US10422028B2 patent drawing
  • US10422028B2 patent drawing

AI summary

A method for conditioning a ceramic layer with a thickness of less than 150 μm over a substrate is provided. The ceramic layer is cleaned. A region of the ceramic layer is scanned with a pulsed excimer laser beam at a repetition rate of 3-300 Hz.