Synchronous Machine Power Electronics Cooling for Exciter Heat Control
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Solution Overview
Problem
Existing power electronics arrangements for externally excited synchronous machines suffer from suboptimal cooling of the exciter power module, leading to higher temperatures, increased weight, and reduced efficiency, which necessitate larger designs and higher manufacturing costs.
Innovation Solution
A closed heat sink with adapted cooling structures provides improved cooling for the exciter power module by enhancing the cooling surface and fluid flow pathways, including swirling, while maintaining optimal cooling for inverter power modules, using materials like aluminum and diverse attachment methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the exciter power module is thermally coupled to the heat sink without dedicated cooling structures, then the device complexity is reduced, but the temperature of the exciter power module increases significantly (up to 30 K higher than inverter regions)
Solution Approach 1:
The patent applies local quality by implementing cooling structures specifically in the region of the exciter power module rather than using a uniform cooling approach throughout the heat sink. This localized cooling adaptation addresses the specific thermal needs of the exciter power module, which generates different heat levels compared to the inverter power modules, thereby reducing temperatures in the exciter region without unnecessarily complicating the entire cooling system.
Solution Approach 2:
The heat sink is segmented into different cooling zones: a first cooling structure for the inverter power modules and a second cooling structure for the exciter power module. This segmentation allows each region to be optimized independently for its specific thermal requirements, with the second cooling structure specifically addressing the exciter power module's cooling needs while the first handles the inverter modules.
2Temperature
If larger power semiconductor components are used to distribute heat over larger surfaces, then the temperature is reduced, but the weight and design volume of the exciter power module increase
Solution Approach 1:
The patent replaces the mechanical approach of increasing component size for heat distribution with a thermal management approach using dedicated cooling structures. Instead of enlarging power semiconductor components to distribute heat over larger surfaces, the invention introduces a second cooling structure with cooling channels that actively remove heat from the exciter power module, thereby maintaining lower temperatures without increasing component size, weight, or design volume.
3Productivity
If the cooling fluid flow path is optimized for inverter power modules, then inverter cooling efficiency is maximized, but the exciter power module receives insufficient cooling flow
Solution Approach 1:
The cooling fluid flow path is segmented into separate channels: a first cooling channel for the inverter power modules and a second cooling channel for the exciter power module. This segmentation allows the cooling fluid to be directed to both regions with appropriate flow distribution, ensuring that the inverter power modules receive optimized cooling for maximum efficiency while the exciter power module simultaneously receives sufficient cooling flow to maintain reliability and service life.
Solution Approach 2:
The cooling system implements local quality by providing region-specific cooling channels tailored to the thermal characteristics of different power module types. The second cooling channel is specifically designed to address the cooling needs of the exciter power module, which has different thermal requirements compared to the inverter power modules, thereby ensuring adequate cooling flow reaches the exciter region without compromising the optimized cooling of the inverter modules.
4Device complexity
If the exciter power module is positioned at the inlet or outlet side of the heat sink, then the device complexity is reduced, but optimal cooling flow cannot be achieved in that region
Solution Approach 1:
The patent segments the heat sink into distinct cooling zones with dedicated cooling channels, allowing the exciter power module to be positioned at the inlet or outlet side without compromising cooling effectiveness. The second cooling channel is specifically configured to deliver cooling fluid to the exciter power module's location, ensuring that even though the module is positioned at an extreme end of the heat sink, it still receives optimal cooling flow through the specialized channel design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the exciter power module's size, weight, and manufacturing costs, enhances performance and service life, and prevents premature derating, thereby improving overall efficiency and reducing thermal stress.
Implementation Method 1
fasten and attach the exciter power module in addition thermally to a heat sink provided for the at least one inverter power module
Implementation Method 2
cool the exciter power module by convection of air
Implementation Method 3
produce swirling of the cooling fluid, which is typically cooling water
Implementation Method 4
employing thermal attachment methods like soldering, sintering, or clamping to enhance thermal coupling
Data Source
AI summary
A power electronics arrangement for an externally excited synchronous machine, may include an inverter power module for each phase of the synchronous machine to form an inverter, an exciter power module including an exciter circuit as well as a common heat sink, to which the power modules are secured and thermally coupled for cooling. The heat sink may comprise a cavity including cooling structures for each inverter power module, each cooling structure being situated adjacent to a respective inverter power module. The cavity may receive a flow for active cooling of the power modules of a cooling fluid entering through an inflow opening of the heat sink to an outflow opening of the heat sink. A cooling structure may be associated with the exciter power module, the cooling structure being adjacent to the excited power module in the cavity.