Exhaust Part Cleaning Frequency in Semiconductor Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The maintenance frequency of the exhaust part in semiconductor device manufacturing processes is high due to byproduct accumulation, which complicates cleaning and increases downtime, as byproducts tend to adhere and fixate within the exhaust system, making regular cleaning difficult and inefficient.
Innovation Solution
A technique that involves setting a higher frequency for cleaning the exhaust part using a first cleaning gas, such as HF gas, directly supplied into the exhaust pipe, compared to the cleaning frequency of the process vessel, allowing for more frequent removal of byproducts before they fixate, thereby reducing maintenance needs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cleaning is performed at the same frequency for both the exhaust part and the process vessel, then the cleaning schedule is simple, but the exhaust part requires frequent maintenance due to byproduct accumulation
Solution Approach 1:
The patent divides the cleaning operation into two separate segments: cleaning the process vessel and cleaning the exhaust part. These are performed at different frequencies and with different cleaning gases. The process vessel is cleaned less frequently with a first cleaning gas, while the exhaust part is cleaned more frequently with a second cleaning gas, allowing each component to be maintained optimally without complicating the overall system management.
2Reliability
If cleaning is performed frequently on the exhaust part, then byproducts are removed before fixation, but maintenance time and operational interruptions increase
Solution Approach 1:
The patent replaces mechanical cleaning methods with chemical cleaning by introducing a second cleaning gas into the exhaust part. This chemical cleaning process effectively removes byproducts before they fixate without requiring physical disassembly or mechanical intervention, significantly reducing maintenance downtime while maintaining high cleaning effectiveness.
3Reliability
If the same cleaning gas is used for both the process vessel and the exhaust part, then the cleaning process is simplified, but the exhaust part cleaning is insufficient due to byproduct fixation
Solution Approach 1:
The patent applies local quality by using different cleaning gases for different components. A first cleaning gas is used for the process vessel, while a second cleaning gas with specific chemical properties is used for the exhaust part. This localized approach ensures that each component receives the most appropriate cleaning treatment, with the second cleaning gas specifically selected to effectively remove byproducts from the exhaust part before they fixate.
Solution Approach 2:
The patent introduces a second cleaning gas as an intermediary substance that mediates the cleaning process in the exhaust part. This second cleaning gas acts as a chemical mediator that reacts with and removes byproducts before they can fixate on the exhaust part surfaces, enabling effective cleaning without direct mechanical intervention.
4Reliability
If maintenance of the exhaust part is performed regularly, then byproduct accumulation is controlled, but productivity decreases due to frequent interruptions
Solution Approach 1:
The patent enables continuous substrate processing by implementing a chemical cleaning system for the exhaust part that operates without interrupting the main processing workflow. The second cleaning gas is introduced to continuously remove byproducts before they fixate, maintaining exhaust part functionality throughout the substrate processing operation and eliminating the need for periodic shutdowns for maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the maintenance frequency of the exhaust part by ensuring byproducts are etched and removed before they become permanently fixed, leading to lower replacement frequencies of vacuum pumps and exhaust pipes, thus enhancing operational efficiency and reducing downtime.
Implementation Method 1
cleaning an interior of the exhaust part by supplying a first cleaning gas from a supply port installed in the exhaust pipe directly into the exhaust pipe
Implementation Method 2
cleaning an interior of the process vessel by supplying a second cleaning gas into the process vessel
Data Source
AI summary
There is provided a technique that includes: processing a substrate in a process vessel by supplying a processing gas to the substrate and exhausting the processing gas from an exhaust part including an exhaust pipe and a pump; cleaning an interior of the exhaust part by supplying a first cleaning gas from a supply port installed in the exhaust pipe directly into the exhaust pipe; and cleaning an interior of the process vessel by supplying a second cleaning gas into the process vessel, wherein a frequency of performing the act of cleaning the interior of the exhaust part is set higher than a frequency of performing the act of cleaning the interior of the process vessel.